Staff Equipment Development Engineer - Advanced Packaging

Job Title

Staff Equipment Development Engineer - Advanced Packaging

Role Summary

Work on Advanced Technology Packaging Development (APTD) to design, develop, and optimize first‑of‑a‑kind (FOAK) wafer and die equipment for post‑probe and assembly processes. Collaborate with process development, manufacturing, and equipment vendors to move equipment from concept through implementation in development and production sites.

This role focuses on equipment maturity, failure analysis, optimization for cost and availability, and support of equipment transfers to production.

Experience Level

Senior. The posting specifies a minimum of 2+ years of semiconductor process or equipment engineering experience; responsibilities and title indicate a senior/staff level role.

Responsibilities

Primary responsibilities include leading equipment development and optimization for post‑probe and assembly processing, diagnosing failures, and driving transfers to production.

• Develop strategies to improve maturity and reliability of FOAK hardware.
• Create 5+ year hardware roadmaps for post‑probe wafer and die processing equipment.
• Design and optimize wafer and assembly equipment to meet physical and electrical product requirements.
• Optimize equipment to reduce cost, increase availability, and improve hardware and process capability.
• Collaborate with process development teams and OEM vendors to implement solutions and improvements.
• Perform root cause and failure mode analysis (FMEA, 8D, FDC/data analysis) and drive corrective actions.
• Conduct fundamental research to enable next‑generation equipment innovations.
• Support equipment evaluation, qualification, and transfer to production (domestic/international travel possible).

Requirements

Required technical skills and experience (must‑have vs. nice‑to‑have summarized):

• Must‑have: 2+ years semiconductor process or equipment engineering experience; fundamental understanding of post‑probe and assembly process and equipment interactions.
• Must‑have: Experience with design of experiments (DOE), Statistical Process Control (SPC), defect analysis, and data analysis.
• Must‑have: Ability to resolve complex issues through root‑cause or model‑based problem solving and meet commitments.
• Must‑have: Hands‑on experience with wafer/assembly tools and overlay systems.
• Nice‑to‑have: Knowledge of robotics, machine logic/language, or hardware design concepts.
• Nice‑to‑have: Experience in wafer/die bonding, plating, warpage control, or other packaging field experience.

Education Requirements

Minimum: Master’s degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or a related technical field. The posting allows equivalent experience in lieu of degree. Preferred: Ph.D. in a related engineering or technical field or equivalent experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.