Staff Engineer, RFFE Process and Device

Job Title

Staff Engineer, RFFE Process and Device

Role Summary

Join the Qualcomm Si Process Packaging Solutions (PPS) team to evaluate, develop, and productize silicon process technologies for mixed-signal and RF products at foundry partners. The role focuses on process and device enablement for RFFE designs (RF switching, antenna circuits, receivers, transmitters) and close collaboration with design, PDK, reliability and product teams to meet performance and quality targets.

Experience Level

Senior. Qualcomm prefers candidates with substantial industrial experience in advanced CMOS/process and RF-device development; specific preferred experience levels are described in the Education Requirements section.

Responsibilities

Deliver technical ownership for process evaluation, device characterization, and design enablement for RF front-end electronics.

• Evaluate bulk Si and RF-SOI technologies and drive process development for RFFE components (switches, antenna circuits, receivers, transmitters).
• Collaborate with design and product teams to define and refine process and device requirements.
• Define and execute DOE for test structures, create layouts, and perform electrical characterization.
• Design, simulate, and test RF circuits to analyze process–design–layout interactions and guide optimization.
• Coordinate with PDK, reliability, and product engineering to ensure technology support and qualification.
• Support design, layout, PTE and reliability teams to resolve device and design optimization issues.
• Establish testing methodologies and validate product and system capabilities to assure quality.
• Drive innovation in device/process improvements and support automation and AI-assisted workflows.

Requirements

Key technical skills and experience required for successful performance in the role.

• Experience in process and device engineering for RF applications, including process integration and reliability.
• Strong understanding of RF-CMOS, SOI or BiCMOS process integration, design rules and layout best practices.
• PDK knowledge including DRC, LVS and layout-parasitic extraction workflows.
• Device-level test-structure development and DOE design; statistical analysis and data-driven problem solving.
• Knowledge of sub-micron process/device optimization and its impact on analog, RF and digital circuit performance.
• RF and DC device characterization skills (S-parameters, harmonics, noise figure, wafer and product-level measurements).
• Experience with technology evaluation/benchmarking, SPC monitoring and reliability qualification.
• Familiarity with device modeling and hardware correlation (experience with BSIM or PSP-SOI models is beneficial).
• Ability to work independently, own technical execution and meet schedule commitments; strong communication skills.
• Nice-to-have: wafer-level analog IP design experience (LNA, PA), foundry/OSAT interface experience, fab device engineering background, and experience with automation or AI-assisted workflows.

Education Requirements

Minimum qualifications specify one of the following: Bachelor's degree in Science, Engineering, or a related field with 4+ years of relevant ASIC/design/integration experience; OR Master's degree in Science, Engineering, or related field with 3+ years of relevant experience; OR PhD in Science, Engineering, or related field with 2+ years of relevant experience. Fields mentioned include Science and Engineering (broadly); equivalent relevant industry experience may satisfy education/experience combinations per the posting.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.