Staff Engineer – Process Development, Thin Film (CVD/Diffusion), NAND

Job Title

Staff Engineer – Process Development, Thin Film (CVD/Diffusion), NAND

Role Summary

Responsible for ownership of defined portions of NAND advanced thin films process development (dielectric and carbon films via CVD/Diffusion). Drive process robustness, capability, and integration readiness by executing experiments, characterizing films, and translating results into scalable process improvements.

Collaborate with integration, device, tool engineering, and suppliers; mentor junior engineers and contribute to team knowledge sharing.

Experience Level

Senior — PhD with ≥3 years, Master's with ≥5 years, or Bachelor's with ≥7 years of relevant industry or research experience.

Responsibilities

Deliver experimental development, scaling, integration, and tool engagement for thin film processes within assigned scope.

• Develop, optimize, and characterize CVD and diffusion thin film processes to meet performance, reliability, and manufacturability targets.
• Design and execute experiments, analyze data, and translate findings into process improvements and scalable solutions.
• Own defined portions of a process module; track margins, sensitivities, integration risks, and drive issue resolution.
• Work with integration and device teams to ensure structural and electrical compatibility; support failure analysis and root-cause investigations.
• Support tool qualifications, upgrades, transfers, and supplier partnerships to improve tool stability and capability.
• Communicate results through reports and reviews; mentor junior engineers and contribute to continuous improvement efforts.
• Incorporate AI-assisted tools and insights where appropriate to improve efficiency and quality, following organizational standards.

Requirements

Essential technical skills, practical experience, and behavioral competencies required.

• Technical: Fundamentals of thin film deposition (CVD/Diffusion), materials chemistry and process physics; familiarity with fab metrology and film characterization (structural, mechanical, optical, electrical); working knowledge of plasma processes, vacuum systems, and chemical reactions.
• Behavioral: Strong execution ownership, structured troubleshooting, cross-functional collaboration, and concise technical communication.
• Preferred: Understanding of NAND thin film structure and electrical requirements; prior experience supporting tool qualification, transfers, and supplier engagement.

Education Requirements

PhD with ≥3 years, or Master's with ≥5 years, or Bachelor's with ≥7 years of relevant experience. Relevant fields include Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related technical disciplines. Equivalent practical experience is accepted.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.