Staff Engineer, Package-Silicon Integration

Job Title

Staff Engineer, Package-Silicon Integration

Role Summary

Drive package-silicon integration for next-generation NAND packaging technologies within Micron’s Package Development Engineering organization. Lead cross-functional technical workstreams to identify, assess, and mitigate chip-package interaction risks across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing.

Own technical investigations and integration solutions, applying data-driven methods and AI-enabled tools to accelerate engineering learning and enable robust design and manufacturing outcomes.

Experience Level

Senior-level; the posting requests a minimum of 4–5 years of relevant semiconductor experience in package-silicon integration, advanced packaging, wafer technology, assembly, reliability, materials, or process development.

Responsibilities

Key responsibilities include leading technical integration workstreams and translating findings into manufacturing-ready controls.

• Lead chip-package interaction (CPI) risk assessments for new silicon, package architectures, materials, and processes.
• Partner with silicon, package, wafer fab, and assembly teams to resolve dicing, singulation, die integrity, and integration challenges.
• Plan and execute technical investigations using DOE, statistical analysis, physical characterization, failure analysis, and reliability data.
• Drive root-cause analysis and implement solutions for yield, quality, reliability, and manufacturability issues.
• Define and execute test vehicles, characterization strategies, process windows, and qualification plans.
• Translate technical learning into design rules, specifications, FMEA controls, and Best-Known Methods (BKMs).
• Use AI, automation, and data analytics to improve engineering efficiency, knowledge capture, and decision-making while applying engineering judgment to validate AI outputs.
• Drive technology readiness and transition of new silicon and package technologies into manufacturing.
• Provide technical guidance and mentoring; communicate technical risks and recommendations across teams and leadership.

Requirements

Must-have technical skills and professional capabilities for performing the role.

• Strong understanding of semiconductor fabrication, packaging, assembly, materials, and reliability.
• Experience with CPI, wafer/die mechanics, dicing, die integrity, package assembly, characterization, failure analysis, or reliability testing.
• Proven ability with DOE, statistical analysis, root-cause analysis, DFMEA/PFMEA, and structured problem solving.
• Ability to connect physical failure mechanisms to silicon, package, material, and process interactions and translate findings into design and process controls.
• Proficiency using data analytics, automation, and AI-enabled tools to support engineering analysis, documentation, and problem solving; ability to critically assess AI outputs.
• Strong cross-functional collaboration, technical leadership, and communication skills; demonstrated ability to independently lead complex technical investigations.

Education Requirements

Bachelor’s degree or higher in Mechanical, Materials, Electrical/Electronic, Chemical, Semiconductor Engineering, Physics, or a related technical discipline.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.