Staff Engineer, HBM Test Vehicle Design

Job Title

Staff Engineer, HBM Test Vehicle Design

Role Summary

Lead design and development of test vehicles for HBM technology to enable learning and reduce risk for future product generations. Partner with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams within the DTPCO organization to translate product and technology challenges into actionable test vehicle solutions.

Focus on developing representative test vehicles and characterization structures that produce data driving product and technology decisions across future HBM generations.

Experience Level

Senior - typically requires 5+ years of semiconductor experience.

Responsibilities

Lead technical definition, implementation, and analysis of HBM test vehicles and structures.

• Define test vehicle content, structure specifications, measurement requirements, and validation objectives.
• Design test structures targeting package interaction, reliability, and manufacturability.
• Analyze silicon characterization, qualification, and failure data; provide actionable recommendations to Design, Product, and Technology teams.
• Develop experimental vehicles that capture product-enveloping learning and enable reuse across HBM programs.
• Lead cross-functional technical investigations into design, process, and package interactions affecting performance and reliability.
• Participate in multifunctional reviews and recommend priorities for future test content.
• Document design guidelines, protocols, and lessons learned to improve future product and technology development.

Requirements

Must-have technical skills and experience; preferred items listed separately.

• 5+ years semiconductor experience in design, product engineering, packaging, technology development, or related areas.
• Strong understanding of semiconductor design and physical implementation fundamentals.
• Experience with silicon validation, characterization, data analysis, or failure investigation.
• Proven ability to work effectively across multiple engineering organizations.
• Proficiency with AI and AI-enabled development workflows.

Nice-to-have:

• Experience with HBM, DRAM, or advanced memory products.
• Experience designing test chips, characterization vehicles, or technology demonstrators.
• Knowledge of advanced packaging technologies (TSVs, hybrid bonding, 3D integration).
• Understanding of reliability qualification methodologies and failure mechanisms.
• Strong written and verbal communication skills for presenting technical findings.

Education Requirements

Master's degree or PhD in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.