Staff Engineer, Advanced Packaging Technology Development

Job Title

Staff Engineer, Advanced Packaging Technology Development

Role Summary

Lead technical development of advanced packaging solutions for DRAM products at Fab 16 in Taichung. The role defines packaging roadmaps, drives module-level process development (wafer-level packaging and 3D stacking), and coordinates cross-functional teams and external partners to deliver manufacturable, cost-effective technologies.

Apply AI-enabled analytics and engineering tools to accelerate development, improve decision-making, and streamline workflows while following responsible AI and data governance practices.

Experience Level

Senior — typically 5+ years in semiconductor advanced packaging; the role requires over 5 years of professional experience.

Responsibilities

Key responsibilities include:

• Lead development and integration of advanced packaging technologies (HBM, 2.5D, 3D integration, hybrid bonding).
• Drive packaging technology roadmaps and define technical requirements using data and competitive analysis.
• Lead multi-disciplinary teams and consult with senior management on technical strategy.
• Collaborate with internal teams and external partners/OSATs to ensure technology transfer and manufacturability.
• Troubleshoot complex process issues and mentor engineers to resolve them.
• Use data intelligence and AI-supported analysis to identify opportunities and improve competitive position.
• Contribute inventions, patents, technical papers, and presentations to advance technology and quality.
• Support cost-reduction and quality-improvement initiatives.

Requirements

Must-have skills and experience:

• Over 5 years professional experience in semiconductor advanced packaging.
• Deep knowledge of High Bandwidth Memory (HBM), 2.5D integration, 3D integration strategies and hybrid bonding.
• Hands-on process engineering experience in Wafer Level Packaging (WLP) or 3D stacking.
• Experience with DRAM manufacturing and with OSAT partners.
• Proven ability to apply AI-enabled engineering tools, data analytics, and digital technologies to improve engineering efficiency.
• Ability to lead technical teams and influence senior management decisions.

Nice-to-have:

• Understanding of DRAM wafer structure and process flows.
• Patent filings or published technical literature.
• Proficiency in East Asian languages in addition to English.

Education Requirements

BS, MS, or PhD in Materials Science, Electrical, Chemical or Mechanical Engineering, Physics, or a related technical field — or equivalent practical experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.