Staff EMIB-T Substrate Yield Engineer

Job Title

Staff EMIB-T Substrate Yield Engineer

Role Summary

Drive supplier yield, defect reduction, technical issue closure, and process-control maturity for next-generation EMIB-T substrates across Taiwan suppliers. Lead yield performance for advanced packaging technologies and enable manufacturing readiness for Intel Foundry Services and Intel product groups.

Experience Level

Senior-level. Posting specifies a Master's degree with 4+ years' experience or a PhD with 2+ years' experience; the role expects 4+ years of relevant semiconductor/advanced packaging experience overall.

Responsibilities

Primary responsibilities include:

• Own day-to-day yield performance and drive issue closure for assigned supplier lines, modules, products, or process areas.
• Lead structured investigations from containment and hypothesis development through experiments, failure analysis, corrective actions, and sustainment.
• Apply statistical and spatial analytics to identify yield signatures by line, tool, material, panel position, geometry, product, and time.
• Define supplier actions, owners, completion criteria, control limits, and verification plans.
• Support DFM/DFY, qualification, ramp readiness, change control, and deployment of dashboards or automated analytics.
• Capture and communicate reusable learnings, hypotheses, decisions, and residual risks to stakeholders.

Requirements

Must-have technical skills and experience:

• 4+ years' experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related field.
• Hands-on experience in substrate/advanced packaging yield engineering: statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and HVM execution.
• Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, or AI/ML-based defect detection and automated defect classification.
• Strong analytical and problem-solving skills with ability to make data-driven decisions and independently manage complex technical issues.
• Proven ability to influence cross-functional teams and external suppliers to achieve technical and schedule objectives.
• Professional proficiency in Mandarin and English sufficient for technical work.

Preferred:

• Direct experience working with substrate suppliers and external manufacturing partners.
• Program leadership experience coordinating cross-functional technical teams in high-visibility projects.
• Experience with semi-additive processing, build-up films, micro vias, copper plating, lithography, lamination, embedded silicon, TSV, or 2.5D/3D packaging and heterogeneous integration.
• Experience with automated data pipelines, image analytics, or automated defect classification systems.

Education Requirements

Master's degree plus 4+ years' relevant experience, or PhD plus 2+ years, in Engineering, Materials Science, Physics, Chemistry, Data Science, or a related technical discipline.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.