Staff Electronics SI/PI Engineer

Job Title

Staff Electronics SI/PI Engineer

Role Summary

Senior electronics engineer in the Packaging, Boards and Multiphysics team focused on signal integrity (SI) and power integrity (PI) for System-on-Chip (SoC) to board integration. The role supports prototype hardware platforms that validate and demonstrate Arm IP, working across chip, package and PCB domains.

Experience Level

Senior-level. No specific years of experience stated.

Responsibilities

Primary responsibilities include system-level SI/PI analysis, PCB and package collaboration, and ensuring interface timing and power delivery meet system requirements.

• Perform system-level signal integrity and power integrity analysis across silicon, package and board.
• Lead SI analysis and propose solutions to meet interface timing and signal quality targets.
• Perform board/system power delivery network (AC and DC) simulations for low-voltage, high-current supplies.
• Work with chip packaging and PCB design teams to define routing strategies, design rules, stack-ups and layer optimizations.
• Collaborate with electrical validation for post-silicon correlation and prototype verification.
• Advise on SoC pin-out, routing feasibility and layer trade-offs to optimize performance and routability.

Requirements

Must-have technical skills and domain experience; separate list for desirable additions.

Must-have:

• Strong understanding of hardware architectures, electronics and embedded compute.
• Deep knowledge of high-speed signal and power integrity and timing analysis techniques across silicon, package and board; electromagnetic modeling of 3D structures.
• Experience with SI analysis of high-density SoCs and verifying routing strategies against specific stack-ups and design rules.
• Detailed understanding of high-speed interface standards (example: PCIe Gen5/6/7, DDR4/5, LPDDR4/5/5x/6, USB, Ethernet).
• Familiarity with IC packaging technologies and their impact on PCB design; understanding of PCB fabrication (PTH, HDI), stackup and via topologies, and substrate materials.
• Experience collaborating with chip packaging teams and influencing device pin-outs.
• Proficiency with SI/EM tools (e.g. ANSYS, Siemens EDA) and PCB layout tools (e.g. Cadence Allegro, OrCAD CIS).
• Good communication and interpersonal skills; attention to detail.

Nice-to-have:

• Design automation and scripting experience.
• Embedded hardware debug experience using lab equipment (oscilloscopes, VNAs).
• Experience working across geographies with distributed teams.

Education Requirements

Not specified.

About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.