Staff Advanced Packaging/Process Engineer of R&D

Job Title

Staff Advanced Packaging/Process Engineer of R&D

Role Summary

Lead development and optimization of advanced packaging processes for optical and photonic devices within R&D. Drive hands-on process development, characterization, and transfer of packaging technologies toward manufacturability and high-volume production.

Experience Level

Senior - typically requires 8+ years of experience in advanced packaging or process engineering within the optoelectronics, photonics, or semiconductor industry.

Responsibilities

Accountable for design, development, and integration of packaging processes and for providing technical leadership in R&D.

• Lead design, development, and optimization of advanced packaging processes from concept to production readiness.
• Perform hands-on process development, characterization, and troubleshooting for die attach, wire bonding, flip-chip, optical alignment, hermetic sealing, and related processes.
• Develop and implement process control strategies, SPC, and DOE to improve yield, reliability, and manufacturability.
• Collaborate with design, product engineering, reliability, and manufacturing for seamless technology transfer.
• Evaluate and qualify new materials, equipment, and manufacturing techniques to improve performance and throughput.
• Perform root cause analysis on packaging failures and implement corrective actions.
• Document process specifications, manufacturing instructions, and test procedures.
• Mentor junior engineers and provide technical leadership within the R&D team.
• Monitor industry trends and emerging packaging technologies relevant to optical/photonic products.

Requirements

Must-have technical skills and experience for success in this role.

• 8+ years of advanced packaging or process engineering experience with an R&D focus in optoelectronics, photonics, or semiconductor industries.
• Proven expertise in multiple packaging technologies (e.g., COB, flip-chip, WLP, SiP, hermetic sealing, optical assembly).
• Proficiency with bonding techniques such as wire bonding, thermocompression, and epoxy attach.
• Strong materials science knowledge related to adhesives, solders, encapsulants, and substrates.
• Hands-on experience with packaging equipment: pick-and-place, wire bonders, reflow ovens, optical alignment systems.
• Experience applying SPC, DOE, and failure analysis methodologies.
• Familiarity with CAD/package design and simulation tools is a plus.
• Excellent problem-solving, analytical, and communication skills; able to work independently and in multidisciplinary teams.

Education Requirements

Master's or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related discipline.

About the Company

Company: Lumentum

Headquarters: Milpitas, California, United States

Lumentum develops optical and photonic products and subsystems for telecommunications, data centers, cloud computing and industrial applications, providing lasers, modulators, transceivers and test solutions that enable high-speed networking and advanced photonics.