Sr. Staff, Signal Integrity and Power Integrity Engineer

Job Title

Sr. Staff, Signal Integrity and Power Integrity Engineer

Role Summary

Responsible for electrical design, modeling, and characterization of high-speed IC packages, focusing on signal integrity (SI) and power integrity (PI) for designs supporting 448 Gb/s and beyond. Works on package selection, layout, manufacturability, and characterization while coordinating with package suppliers, IC designers, assembly, and marketing to meet performance, reliability, and cost targets.

Experience Level

Senior-level position (Sr. Staff). The posting indicates candidates with a Bachelor's plus 5–8 years' related experience, or a Master's/PhD with 1–3 years' related experience.

Responsibilities

Main responsibilities include electrical package development, SI/PI modeling and validation, and cross-functional coordination.

• Develop and validate high-speed IC package electrical designs and layouts.
• Perform SI and PI modeling and characterization, accounting for manufacturing and assembly tolerances.
• Run 2-D and 3-D EM simulations and interpret results to drive design decisions.
• Plan and execute measurement campaigns (VNA, TDR) for package and PCB characterization.
• Work with package suppliers to select technology, drive layout, and ensure manufacturability and cost targets.
• Coordinate with IC designers and marketing to define achievable package specifications.
• Automate SI, PI, and packaging workflows with scripting (e.g., Python).
• Contribute to new package technology development and NPI from concept to production.

Requirements

Key technical skills and experience required or strongly preferred.

• Strong fundamentals in electromagnetics, transmission line theory, and microwave theory.
• Practical experience with 2-D and 3-D EM simulation tools such as Ansys HFSS, SIwave, Cadence Clarity.
• Experience managing package development across cross-functional teams (assembly, IC layout, analog/digital designers).
• Familiarity with IC package layout tools (e.g., APD, PADS).
• Ability to script and automate analysis tasks (Python).
• Working knowledge of circuit simulation tools (Spectre, ADS, HSpice).
• Experience with VNA and TDR measurements for package and PCB characterization.
• Experience in power plane design, modeling, and analysis (PowerSI, SIwave) and PI techniques.
• Understanding of EMI/EMC issues and debugging approaches.
• Strong communication, presentation, and documentation skills; team player.
• Nice-to-have: experience with Co-Packaged Optics, 2.5D/3D package development, thermal/mechanical analysis, channel simulations (MATLAB/ADS), and track record of new product introduction.

Education Requirements

Bachelor's degree in Computer Science, Electrical Engineering, or a related field with 5–8 years of related professional experience; or a Master's or PhD in Computer Science, Electrical Engineering, or a related field with 1–3 years of related experience. (Degrees or equivalent experience specified in the source.)

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.