Marvell Technology logo

Sr. Staff Engineer, Packaging Engineering

Marvell Technology
May 10, 2026
Full-time
On-site
Hsinchu, Taiwan
Process Engineering Jobs, Level - Senior

Job Title

Sr. Staff Engineer, Packaging Engineering

Role Summary

Member of the package engineering team driving semiconductor IC package development from concept through NPI to mass production. The role defines package solutions, provides design inputs for manufacturability, and coordinates cross-functional teams and suppliers to deliver production-ready packages.

Primary focus areas include package design review, supplier (OSAT/substrate) management, package characterization and qualification, and supporting new package and technology development.

Experience Level

Senior — typically 5+ years of semiconductor packaging experience (5–7 years with a Bachelor's degree; 3–5 years with a Master’s or PhD).

Responsibilities

Key responsibilities include defining package solutions, driving NPI schedules, and managing supplier deliverables.

  • Define optimal package solutions based on product and client requirements, addressing manufacturability, performance, cost, quality, and reliability.
  • Conduct package design reviews and provide design inputs and guidelines.
  • Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package characterization and qualification.
  • Coordinate with BU, CE, QA and product engineering to meet NPI milestones and schedule targets.
  • Work with QA and suppliers to investigate and resolve package-related quality and reliability issues.
  • Provide inputs to package technology roadmap and support development of new package solutions.

Requirements

Must-have technical skills and experience; optional items noted.

  • Experience with substrate, RDL and assembly processes.
  • Experience in flip-chip package development and substrate review.
  • Basic Cadence APD and AutoCAD skills.
  • Understanding of semiconductor technologies, first-level assembly processes, packaging materials, reliability standards, and failure analysis techniques.
  • Knowledge of 2D, 2.5D, 3D and wafer-level packaging technologies.
  • Good written and verbal communication skills for cross-functional and supplier interaction.
  • Program management skills to drive projects and milestone delivery.
  • OSAT management experience is a plus.
  • Ability to work independently and take ownership of deliverables.

Education Requirements

Required: Bachelor's degree in Mechanical Engineering, Materials Science, or a related field (typical experience: 5–7 years). Alternatives: Master’s degree or PhD in Mechanical Engineering, Materials Science, or related fields (typical experience: 3–5 years). Fields of study listed in the posting: Mechanical Engineering, Material Science, or related technical fields. No certifications were specified.


About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.

Marvell Technology logo

Date Posted: 2026-05-10