Sr. Signal Integrity/Power Integrity Engineer

Job Title

Sr. Signal Integrity/Power Integrity Engineer

Role Summary

Senior engineering role in AMD's Networking Technology & Solutions Group (NTSG) focused on ensuring signal integrity (SI) and power integrity (PI) across high-speed channels, packages, PCBs and systems. The position requires design, modeling, simulation, and lab validation to meet reliability, performance, and manufacturability targets for next-generation products.

Experience Level

Senior — typically 10+ years of experience in high-speed signal integrity and power integrity engineering (per preferred qualifications).

Responsibilities

Primary responsibilities include modeling, simulation, PCB/package guidance, lab validation, and cross-functional coordination to deliver robust high-speed designs.

• Model and simulate end-to-end high-speed channels including transceivers, IC package, PCB, connectors and cables.
• Perform time- and frequency-domain SI analysis (IBIS-AMI, SPICE, full-wave EM) and interpret results to provide design guidelines.
• Identify and resolve link issues: loss, reflection, crosstalk; optimize Eye Diagram, BER and SNR.
• Perform Channel Operation Margin (COM) and DOE sweeps across process corners and routing variations.
• Drive PCB physical design: create stack-ups, design rules, review layouts, and recommend material/placement changes.
• Work on critical circuits (reference clocks, high-speed signals) to ensure SI and PI targets are met.
• Support lab validation and debugging to correlate measurements (TDR, VNA, oscilloscopes) with simulations.
• Collaborate with Silicon IP, packaging, PCB, system architects and external suppliers to meet schedules and scope.
• Stay current on SI/PI methods and high-speed design technologies; apply new techniques to improve product performance.

Requirements

Technical skills and experience required or strongly preferred for success in this role.

• 10+ years of practical experience in signal integrity and power integrity engineering for high-speed systems.
• Strong background in PCB and package design for SI/PI and knowledge of high-speed architectures and interconnects.
• Deep familiarity with high-speed interfaces such as PCIe, Ethernet, DDR.
• Proficiency with SI/PI simulation tools (Keysight ADS, Cadence Sigrity, Ansys HFSS or equivalent).
• Experience with data analysis and automation using MATLAB or Python.
• Hands-on lab testing experience with TDR, VNA, high-speed oscilloscopes and spectrum analyzers.
• Proven ability to translate simulation results into PCB/material/stack-up/layout recommendations.
• Excellent problem-solving skills and demonstrated cross-functional collaboration.
• Location requirement: position based in Santa Clara, CA; not eligible for visa sponsorship.

Education Requirements

Master's or PhD in Electrical Engineering, Computer Engineering, or a closely related field (stated academic credential). No mention of Bachelor's-only or "equivalent experience" language in the posting.

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.