Sr. Product Development Engineer

Job Title

Sr. Product Development Engineer

Role Summary

Responsible for chip-package interaction (CPI) issues for Micron DRAM products from pathfinding through NPI into high-volume manufacturing. Lead package program plans for new DRAM fab process nodes, coordinate device/package/module reviews, and drive cross-functional risk mitigation for DRAM 3DS products.

Experience Level

Senior level. The posting specifies 60 months (5 years) of engineering-related experience; title indicates senior responsibility.

Responsibilities

Primary responsibilities include program planning, technical reviews, and resolving CPI issues across fabrication, assembly, and package domains.

• Define and execute package program plans for new DRAM process nodes and 3DS products.
• Investigate and resolve CPI issues from pathfinding through NPI into high-volume manufacturing.
• Coordinate end-to-end device, package, and module technical reviews with cross-functional teams.
• Assess risks related to BEOL, memory array fabrication, wafer probe flows, bumping/flip-chip assembly, and materials/process interactions.
• Translate electrical failure data into physical root-cause assessments and corrective actions.
• Develop qualification, screening, and reliability test plans to control CPI risks.

Requirements

Must-have technical expertise and experience relevant to DRAM device, assembly, and packaging engineering.

• Knowledge of DRAM/NAND device structure and operation.
• Understanding of chip-package interaction including assembly stresses and package design impacts.
• Ability to use device and package design files for CPI and packaging risk assessments.
• Experience with wafer probe and test flows, electrical data analysis, and correlating failures to physical defects under varied temperature/voltage conditions.
• Familiarity with memory device fabrication, specifically memory array and backend-of-line (BEOL) processes.
• Experience with reliability degradation mechanisms, accelerated stress testing, and sampling statistics to design effective qualification plans.

Education Requirements

Master's degree in Materials Science Engineering, Chemical Engineering, Metallurgical Engineering, Electrical Engineering, Physics, or a related field is accepted; the posting requires 60 months of experience in the job offered or in an engineering-related occupation.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.