Sr. Principal Engineer, Manufacturing Infrastructure

Job Title

Sr. Principal Engineer, Manufacturing Infrastructure

Role Summary

Lead technical development and program execution for next-generation manufacturing and test infrastructure enabling transition of advanced silicon, photonics, and co-packaged optics/copper architectures into high-volume manufacturing.

Part of the Advanced Technology Infrastructure team; work across Design, Packaging, Operations, and Quality to deliver robust, scalable test and infrastructure solutions for AI-scale networking products.

Experience Level

Senior — requires extensive industry experience; posting specifies 15+ years of relevant experience.

Responsibilities

Deliver technical leadership and program management for complex hardware and manufacturing infrastructure projects.

• Orchestrate end-to-end integration and delivery of complex infrastructure programs, enforcing schedules and performance targets for on-time transition to HVM.
• Drive technical milestones for new test hardware development, including Known Good Die (KGD), CPO, and CPC solutions.
• Serve as primary integration lead across Thermal, Mechanical, Photonic, Signal Integrity and Power Integrity teams to deliver unified hardware and test solutions.
• Collaborate with Design, Packaging, Operations, and Quality to align infrastructure capabilities with product requirements.
• Translate customer roadmaps and specifications into internal engineering roadmaps and technology readiness schedules.
• Manage partner relationships and jointly develop long-term technical roadmaps for manufacturing and test hardware.
• Execute transfer-to-manufacturing protocols, evaluate and qualify partners, and manage global deployment from wafer sort through system-level test.
• Own project schedules, track critical path deliverables, and implement risk mitigation frameworks.
• Represent technical progress at industry forums and monitor trends in advanced packaging, photonics, and high-speed signaling.
• Optimize solutions for manufacturing yield, repeatability, and throughput through engineering feedback.

Requirements

Core technical and leadership qualifications required to perform the role.

• Extensive experience in Product Engineering, Mechanical Design, and Systems Integration for high-speed custom silicon and advanced packaging.
• Experience developing and validating test solutions for silicon photonics, photonic interposers, and high-speed interconnect architectures.
• Proven track record executing technology transfers from R&D to HVM and supporting global Operations and Quality handover.
• Mastery of project management tools and methodologies for complex hardware development cycles.
• Experience in customer-facing technical roles and translating external requirements into internal engineering plans.
• Strong ability to influence and lead cross-functional teams and drive consensus across Design, Packaging, Operations, and Finance.
• Eligibility to access export-controlled technology may be required; candidates may be subject to export license review.

Nice-to-have:

• Deep ongoing awareness of semiconductor and photonics industry trends and emerging technologies.

Education Requirements

Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Physics, or equivalent; 15+ years of relevant experience. Equivalent practical experience will be considered per the posting.

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.