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Sr. Engineer, Package Design

Tenstorrent
August 27, 2026
Full-time
Remote friendly (Santa Clara, California, United States)
United States; Canada; Taiwan
$100,000 - $500,000 USD yearly
Physical Design Jobs, Level - Senior

Job Title

Senior Engineer, Package Design

Role Summary

Design board-level routing studies, PCB mock-ups, and SI/PI modeling to support early-stage semiconductor package and package-board co-design. Work with signal integrity, power integrity, mechanical, and system teams to create representative PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling.

This is a hybrid role based out of Santa Clara, CA; Austin, TX; Toronto, ON; or New Taipei City, TW.

Experience Level

Senior. Typical candidates meet the technical requirements below (including 3+ years with Cadence Allegro), but the company may adjust the level during the interview process.

Responsibilities

You will focus on early-stage package/board co-design and electrical modeling to inform package architecture and system implementation.

  • Create board-level routing studies and PCB design mock-ups for advanced packages.
  • Develop SI/PI modeling collateral and representative PCB routing environments for BGA optimization and package escape analysis.
  • Analyze routing congestion, layer utilization, and signal escape strategies.
  • Collaborate with signal integrity, power integrity, mechanical, and system engineering teams to align electrical and mechanical constraints.
  • Contribute to system-level electrical modeling and support tradeoff evaluations across package and board designs.

Requirements

Must-have technical skills and experience.

  • 3+ years of experience with Cadence Allegro PCB Designer.
  • Experience with high-pin-count BGAs and complex connectivity requirements.
  • Ability to analyze routing congestion, layer utilization, and signal escape strategies.
  • Working knowledge of signal integrity and power integrity principles.
  • Strong communication skills and ability to collaborate across engineering disciplines.

Nice-to-have:

  • Experience applying automation, data analytics, or AI techniques to engineering workflows.
  • Familiarity with advanced packaging concepts (chiplets, 2.5D, on/off-package memory) and emerging power delivery approaches.

Education Requirements

Not specified.


About the Company

Company: Tenstorrent

Headquarters: Austin, Texas, United States

Tenstorrent is a technology company focused on designing innovative computing solutions. They are known for their expertise in the development of advanced hardware, including ASICs and SoCs, aimed at enhancing performance and efficiency in various applications.

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Date Posted: 2026-08-27