Sr Advanced Packaging Technology Development Engineer, FILM process

Job Title

Sr Advanced Packaging Technology Development Engineer, FILM process

Role Summary

Drive FILM process and advanced packaging technology development for HBM and chip-stacking (2.5D/3D) applications at the Taichung Fab-16 site. Act as a technical contributor and on-site consultant across project execution, yield improvement, and cross-site characterization efforts.

Experience Level

Senior role. The posting specifies at least 3 years of relevant industry experience in FILMs (CVD, PVD); PhD is a plus.

Responsibilities

Main responsibilities include process development, troubleshooting, cross-team coordination, and technical documentation.

• Drive HBM process development and yield improvement for FILM processes.
• Support advanced packaging R&D including chip stacking, 2.5D and 3D integration.
• Act as technical consultant for on-site project execution and decision-making.
• Troubleshoot complex process issues, perform root-cause analysis, and implement corrective actions.
• Coordinate materials and mechanical characterization across global sites (US, Japan, Singapore).
• Recommend and review test-structure and test-vehicle designs for material property evaluation.
• Summarize and present data, provide material recommendations, and lead supplier technical discussions.
• Generate technical reports and internal/external presentation materials.
• Apply AI‑assisted tools and digital methods to improve efficiency and analysis while following organizational standards.

Requirements

Key skills and experience required or preferred for successful candidates.

• Must-have: Minimum 3 years of industry experience working with FILMs (CVD, PVD).
• Solid understanding of thin-film deposition principles and process characteristics (uniformity, stress, adhesion, step coverage, defect behavior).
• Proven troubleshooting and root-cause analysis skills for process engineering issues.
• Strong data review, interpretation, and presentation skills; ability to lead technical discussions with suppliers.
• Good teamwork, independent thinking, and high motivation.
• Fluent communication in English and Chinese.
• Nice-to-have: Hands-on experience with CVD/PVD production tools (e.g., Applied Materials, Lam, TEL).
• Nice-to-have: Experience in mechanical/materials characterization for advanced packaging.
• Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly.

Education Requirements

Master's degree or higher in Chemistry, Physics, Materials, Engineering Science, or a related technical field; PhD preferred. (The posting specifies graduate-level education; no explicit equivalent-experience language provided.)

Equal Opportunity

Micron is an equal opportunity employer and complies with applicable labor and industry standards.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.