Software Engineer, Package Layout Design — 3D‑IC Solutions

Job Title

Software Engineer, Package Layout Design — 3D-IC Solutions

Role Summary

Join a team developing software and workflows that integrate EDA and MCAD tools for 2.5D and 3D system-in-package (SiP) designs. The role focuses on enabling multi-die planning, physical implementation, verification, and manufacturing test through tool integration and automation.

Work includes building methodologies and automation for package and substrate layouts, multi-die assembly, verification flows, and providing technical guidance to internal teams and customers.

Experience Level

Senior — typically requires 5+ years of relevant industry experience.

Responsibilities

The role is responsible for integrating tools and developing workflows for advanced packaging and 3D-IC designs. Key responsibilities include:

• Integrate physical implementation and 3D-IC planning tools to enable complex multi-die package workflows.
• Define and document methodologies for constructing chiplet and multi-die designs within physical design environments and 3D planning platforms.
• Create and integrate substrate/package layouts and ensure correct transfer into 3D-IC planning tools.
• Assemble multi-die/3D packages and perform verification to ensure LVS and DRC cleanliness.
• Develop scripts and automation (Python, Tcl/Tk, Bash, etc.) to streamline workflows and improve tool interoperability.
• Diagnose and resolve technical issues related to tool integration, packaging methodologies, and verification.
• Provide technical guidance and documentation to internal teams and stakeholders.
• Monitor advances in 3D-IC and advanced packaging technologies and evaluate AI applications for design and verification optimization.

Requirements

Core technical requirements and skills. Education requirements are listed separately below.

• Must-have: Hands-on experience with advanced packaging design and 3D package construction; strong working knowledge of package layout tools and 3D-IC planning/integration tools.
• Must-have: Proficiency in scripting and automation using Python, Tcl/Tk, Bash, or similar languages.
• Must-have: Experience with physical implementation/place & route tools and familiarity with 3D LVS and DRC verification flows.
• Must-have: Strong problem-solving skills and clear written/verbal communication; able to work independently and in teams.
• Nice-to-have: Direct experience with package design tools (e.g., Cadence APD/SiP, Siemens Xpedition) and planning solutions (e.g., Siemens Innovator 3D IC, Cadence Integrity/Innovus, Synopsys 3DIC Compiler).
• Nice-to-have: Familiarity with AI applications in EDA workflows, advanced process nodes, and multi-physics analysis (SI/PI, thermal, thermo-mechanical stress).
• Nice-to-have: Experience with IC analysis tools (HyperLynx, Ansys HFSS, Redhawk, Cadence Voltus, PrimeTime) and version control/PLM systems (Perforce, Git, PLM/IPLM).

Education Requirements

Master's degree in Electrical Engineering, Computer Engineering, or a closely related technical field with 5+ years of relevant industry experience. (The posting specifies a Master’s degree plus 5+ years.)

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.