SMTS Device Modeling & Characterization

Job Title

SMTS Device Modeling & Characterization

Role Summary

Join the Ultra-Low-Power CMOS modeling team to develop SPICE compact models and perform device characterization for FDSOI, FinFET and Bulk MOSFET technologies used in Process Design Kits (PDKs) for digital, analog and RF applications. The role covers model development, device measurement interpretation, model-to-hardware correlation, and cross-site collaboration on RF/MMW engagements.

Experience Level

Senior-level. The role requires substantial industry experience and technical leadership.

Responsibilities

Primary responsibilities include technical leadership on device modeling projects, characterization, and customer-facing support.

• Lead SPICE compact-model development projects for FDSOI, FinFET and Bulk MOSFET technologies.
• Design MOSFET characterization and test structures for model extraction.
• Analyze device test data and apply semiconductor physics to evaluate results and debug measurement issues.
• Perform model-to-hardware correlation and statistical analysis (K, CpK); prepare technical reports and recommendations.
• Collaborate with RF/MMW modeling teams and support critical customer engagements for RF/MMW applications.
• Coach and mentor team members; lead cross-functional and cross-site teams.
• Initiate and manage complex projects involving suppliers and external programs as required.
• Follow and support Environmental, Health, Safety & Security requirements and programs.

Requirements

Must-have technical skills and senior-level experience.

• Extensive hands-on experience in device modeling and characterization (senior-level, multi-year).
• Strong device physics knowledge, especially MOSFET behavior and characterization methods.
• Experience developing compact models and delivering model-to-hardware correlation.
• Experience designing test structures and interpreting measurement data; familiarity with process development and measurements.
• Proven ability to lead technical projects, influence cross-functional teams, and mentor junior engineers.
• Effective written and verbal communication skills; able to produce clear technical reports.
• Preferred: familiarity with RF/MMW characterization and modeling, BSIM model families, model extraction tools (e.g., MBP/ICCAP), and MRAM/RRAM modeling.

Education Requirements

PhD or Master’s in Electrical or Electronics Engineering or Device Engineering with emphasis on semiconductor physics or microelectronics. The posting specifies PhD + 8+ years of relevant experience or Master’s + 12+ years of relevant experience; a doctorate is preferred.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.