SMT Engineer, Advanced Package Technology Development (MTS)

Job Title

SMT Engineer, Advanced Package Technology Development (MTS)

Role Summary

The SMT Engineer will drive advanced packaging technology development and roadmap definition within Micron’s Advanced Package Technology Development team. The role focuses on delivering technical solutions, enabling technology integration, and influencing strategic decisions to support product and business goals.

Work is cross-functional and requires collaboration with internal teams and external partners to develop differentiated packaging technologies and improve competitive positioning.

Experience Level

Senior-level. Requires approximately 10+ years of experience in the semiconductor industry, preferably in R&D, technology development, or failure analysis.

Responsibilities

Main responsibilities include technical leadership, roadmap development, and cross-functional integration.

• Define and drive advanced packaging technology roadmaps aligned with business objectives.
• Deliver high-value, differentiated technology solutions and technical innovation.
• Analyze competitive trends and assess metrics for strategic advantage.
• Consult and influence technical and strategic decisions with senior management.
• Collaborate with internal and external partners to ensure seamless technology integration.
• Define technical requirements based on validated data and analysis.
• Innovate through publications, patents, and technical presentations to support wins and quality improvements.
• Manage projects to meet timelines and ensure accurate, high-quality results.
• Work effectively across departments to develop and drive multi-functional initiatives.

Requirements

Key minimum skills and experience. Degrees and fields of study are summarized separately under Education Requirements.

Must-have:

• ~10+ years semiconductor industry experience in R&D, technology development, or failure analysis with strong expertise in failure analysis methodologies and techniques.
• Experience with DRAM technology.
• Experience in front-end fab process integration or module process.
• Understanding of silicon integration and interactions at backend process and package level (CPI).
• Proficiency with simulation tools and data analytics platforms for performance analysis and optimization.
• Track record of technical outputs such as internal/external publications or patents.
• Strong project management, communication, and presentation skills.
• Ability to integrate and collaborate effectively with cross-functional teams.

Nice-to-have:

• Additional domain-specific simulation, modeling, or failure analysis tooling expertise beyond core requirements.

Education Requirements

PhD, Master’s, or Bachelor’s degree in Electrical & Electronic Engineering, Materials Engineering, Mechanical Engineering, Physics, Applied Physics, or a related technical field; or equivalent practical work experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.