Silicon Photonics Advanced Packaging Intern (Summer 2027)

Job Title

Silicon Photonics Advanced Packaging Intern (Summer 2027)

Role Summary

Summer intern role supporting development of electro-optical transceivers on GF's Photonix platform and advanced 2.5D/3D co-packaged optics. The position contributes to chip-package co-design addressing thermal, mechanical, electrical, and optical performance and reliability.

Experience Level

Entry-level internship for current undergraduate or graduate students; suitable for individuals with limited professional experience (typically 0–3 years).

Responsibilities

Key day-to-day responsibilities include:

• Contribute to packaging design rules, product requirements, and manufacturability improvements with internal teams and OSAT partners.
• Participate in cross-functional design reviews and help resolve technical, manufacturability, reliability, and yield issues for new products.
• Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality; document findings and recommendations.
• Support qualification robustness and continuous improvement from concept through production readiness.
• Perform laboratory and hands-on packaging tasks while following Environmental, Health, Safety & Security (EHS&S) requirements.

Requirements

Mandatory and preferred qualifications for candidates.

• Must-have: English proficiency (written and verbal).
• Must-have: Ability to work at least 40 hours per week during the internship and travel up to 10%.
• Must-have: Ability to perform hands-on tasks and follow EHS&S procedures.
• Nice-to-have: Prior internship, co-op, or research experience in semiconductor packaging, photonics, optics, or advanced electronics.
• Nice-to-have: Exposure to thermal, mechanical, electrical, optical, or multiphysics simulation tools.
• Nice-to-have: Familiarity with semiconductor packaging, chiplets, silicon photonics, or co-packaged optics.
• Nice-to-have: Demonstrated leadership in projects or organizations, project management skills, and strong written/verbal communication.
• Nice-to-have: Interest in using AI tools and emerging technologies to improve productivity and decision-making.

Education Requirements

Actively pursuing a Bachelor's or Master's degree (enrolled during the internship) in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related technical field through an accredited degree program. Candidates must be in good academic standing with an overall GPA of at least 3.0.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.