Silicon Photonic Engineer (CPO)

Job Title

Silicon Photonic Engineer (CPO)

Role Summary

Develop and mature silicon photonic devices, process integration flows, and packaging steps for co‑packaged optics (CPO) platforms. Work across device design, process engineering, and advanced packaging to move designs from R&D into scalable, high‑volume manufacturing.

Experience Level

Mid-level engineer. No specific years of experience stated.

Responsibilities

Key responsibilities include device development, process integration, and manufacturing readiness for CPO products.

• Design and optimize silicon photonic devices and building blocks for CPO platforms with emphasis on performance and manufacturability.
• Define and refine process integration flows, including backend and advanced packaging steps for photonic assembly.
• Support PDK component development and design rule maturity for reliable, high‑volume production.
• Collaborate with R&D, fabrication, reliability, product engineering, and customer teams to align technical requirements and deliverables.
• Manage product lifecycle from early development and NPI through qualification and ramp‑to‑production.
• Investigate device/process issues, perform structured root‑cause analysis, and implement corrective actions.
• Engage with customers and partners to accelerate design cycles and improve manufacturability.
• Drive continuous improvement initiatives to enhance yield and streamline processes.

Requirements

Core technical skills and experience needed; preferred items listed separately.

• Must-have: Strong foundation in silicon photonics device design, optical interconnect concepts, and photonic integration.
• Must-have: Experience with process integration, backend assembly techniques, or advanced packaging for photonic systems.
• Must-have: Hands‑on exposure to device design, cleanroom fabrication, and photonic device testing or characterization.
• Must-have: Familiarity with transitioning photonic technologies from development into production environments.
• Must-have: Ability to collaborate across multidisciplinary teams and communicate complex technical topics clearly.
• Must-have: Strong analytical and problem‑solving skills and a record of delivering results in fast‑moving environments.
• Preferred / Nice-to-have: Background in CPO architectures, high‑speed optical interconnects, or photonic packaging solutions.
• Preferred / Nice-to-have: Experience contributing to or developing PDKs for silicon photonics platforms.
• Preferred / Nice-to-have: Exposure to backend processes such as Cu bumping, laser diode attach, TSV, or fiber‑related assembly.
• Preferred / Nice-to-have: Prior involvement in customer‑driven development programs, industry collaborations, publications, or patents.

Education Requirements

Advanced degree expected: MS or PhD in Electrical Engineering, Electrical & Computer Engineering, or a related technical field.

About the Company

Company: Lumilens

Headquarters: San Jose, CA, USA

Lumilens develops integrated photonics and optical interconnect solutions for high-speed data communication and chip-to-chip interfaces, focusing on optical front-end hardware and co-packaged optics for advanced semiconductor systems.