Silicon Packaging Design Engineer
Intel CorporationJob Title
Silicon Packaging Design Engineer
Role Summary
Responsible for end-to-end substrate design from concept through tape-out, focusing on performance, cost, and manufacturability. Collaborate with silicon, package, and board teams to deliver solutions for high-performance applications.
Experience Level
Entry-level (college graduate). Targeted to candidates with roughly 0–3 years of relevant industry or internship experience.
Responsibilities
Key responsibilities include:
- Drive physical layout and routing of package and substrate designs to meet silicon and board performance requirements.
- Perform substrate fit and routing studies and evaluate design, performance, and cost trade-offs.
- Define and implement substrate design rules; conduct internal and external reviews.
- Analyze results, resolve Design Rule Checks (DRCs), and optimize designs for manufacturability and performance.
- Collaborate with cross-functional teams to optimize pinout and silicon-package-board interactions.
- Document design data and maintain records in the product lifecycle management system.
Requirements
Must-have technical skills and competencies:
- Experience with microelectronic package or PCB physical layout design and manufacturing processes.
- Familiarity with package design tools such as Siemens Xpedition, Cadence Allegro Package Design, AutoCAD, or SolidWorks.
- Understanding of physical layout aspects of substrate design, including custom layouts and floor plans.
- Ability to analyze DRCs and optimize designs for manufacturability and performance.
- Effective communication and collaboration skills; ability to manage multiple tasks under tight deadlines.
Preferred:
- Experience in package substrate design, I/O routing, or technology development.
- Familiarity with electrical modeling and simulation tools such as PowerDC, HyperLynx, Q3D, and HFSS.
- Experience with package layout automation tools (PLA, FIELD).
- Scripting experience (Python, VB, C, or similar).
Education Requirements
Bachelor's degree with 1+ years of experience or a master’s degree with 6 months of experience in Electrical Engineering, Mechanical Engineering, or Materials Science. Relevant combinations of education, coursework, research, internships, or equivalent practical experience are acceptable.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
