Silicon Packaging Design Engineer

Job Title

Silicon Packaging Design Engineer

Role Summary

Design and deliver substrate/package layouts from concept through tapeout, optimizing for performance, manufacturability, and cost. Work within the Foundry Technology Manufacturing organization and partner with silicon, hardware, and manufacturing teams to ensure package-board interfaces meet product requirements.

Role follows Intel's hybrid work model with time split between the assigned Intel site (Penang) and off-site work.

Experience Level

Mid-level — typically candidates with roughly 3–7 years of relevant substrate/package design experience. The team expects demonstrated hands-on experience in substrate layout, routing, and design-rule resolution.

Responsibilities

Primary responsibilities include end-to-end substrate design, tradeoff analysis, and cross-functional collaboration.

• Drive substrate design from requirements through tapeout, focusing on performance, cost, and manufacturability.
• Implement physical layout and routing using industry PCB/package design tools.
• Perform substrate fit and routing studies to evaluate design, performance, and cost tradeoffs.
• Document detailed design requirements in package design requirement documents.
• Collaborate with silicon and hardware teams to optimize pinout and silicon-package-board interfaces.
• Apply substrate design rules and resolve design rule checks (DRCs); participate in internal and external design reviews.
• Drive process and design improvements to reduce cost, schedule, or improve quality.

Requirements

Must-have technical skills and experience; preferred items listed separately.

• Several years of hands-on substrate/package design experience (see Experience Level for guidance).
• Proficiency with substrate layout and routing tools such as Cadence APD or Mentor Xpedition.
• Experience using electrical design analysis tools for package evaluation.
• Strong understanding of substrate design rules, DRC resolution, and package-board interface optimization.
• Experience with data analysis and design documentation tools and practices.
• Familiarity with substrate manufacturing and assembly processes.

Nice-to-have:

• Familiarity with high-speed signal integrity and power delivery analysis.
• Strong problem-solving, cross-functional collaboration, and communication skills.

Education Requirements

Bachelor's degree in Electrical Engineering, Mechanical Engineering, Electronics, or a related field is cited as the baseline. The posting specifies experience tradeoffs: typically 4+ years with a Bachelor's, ~3 years with a Master's, and applicants with a PhD may meet requirements with no prior industry experience. Fields noted: Electrical Engineering, Mechanical Engineering, Electronics, or related technical disciplines.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.