Silicon Packaging Design Engineer
Intel CorporationJob Title
Silicon Packaging Design Engineer
Role Summary
Drives end-to-end substrate design for silicon packaging from concept through tapeout, including physical layout and routing of package designs. Collaborates with silicon and hardware teams to optimize electrical performance, pinout, manufacturability, and cost.
Participates in design reviews, resolves design-rule violations, documents design artifacts in the product lifecycle system, and supports customer-facing technical interactions as required.
Experience Level
Mid-level — professional experience expected; see Education Requirements for degree and years guidance.
Responsibilities
Primary responsibilities include technical design, analysis, and cross-functional collaboration to deliver manufacturable substrate designs.
- Perform substrate fit and routing studies to evaluate design, performance, and cost tradeoffs.
- Create and implement physical layout and routing of package designs, ensuring adherence to substrate design rules.
- Define substrate design rules and lead internal and external design reviews.
- Analyze data, run and resolve DRCs, and refine package designs.
- Drive design-for-manufacturability (DFM) strategies to improve yield and cost efficiency.
- Produce comprehensive documentation and store design collateral in the product lifecycle management system.
- Collaborate with silicon, hardware, manufacturing, and customer teams; communicate technical status and tradeoffs.
Requirements
Must-have technical skills and practical experience:
- Experience with package or board design and review tools such as Siemens Xpedition, Cadence Allegro Package Design, Valor NPI, AutoCAD, or SolidWorks.
- Hands-on experience in package design and development, interconnect methodologies, and manufacturability principles.
- Experience resolving DRCs and applying substrate design rules in production flows.
- Experience producing technical documentation and managing design data in PLM systems.
- Strong analytical, debugging, and stakeholder communication skills; proven cross-functional collaboration.
Preferred:
- Familiarity with electrical modeling/simulation tools (PowerDC, HyperLynx, Q3D, HFSS).
- Scripting experience (Python, VB, C or similar) to automate design and analysis tasks.
Education Requirements
Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics with 4+ years of relevant experience; or Master's degree in those fields with 3+ years; or PhD in those fields. These degree and years-of-experience combinations are stated as the minimum qualifications in the posting.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
