Senior Thin Films Metals Deposition Engineer

Job Title

Senior Thin Films Metals Deposition Engineer

Role Summary

Join the Manufacturing Development Customer Engineering (MDCE) team to drive metals deposition module readiness from early development through high-volume manufacturing (HVM) for advanced Intel nodes (e.g., Intel 18A, Intel 3, Intel 12nm). The role bridges Technology Development, HVM, and Customer Engineering to enable robust, manufacturable processes.

Experience Level

Senior - requires experienced individual. Minimums in the posting include 6+ years of relevant semiconductor/process development experience and 4+ years direct experience in metals deposition modules.

Responsibilities

Primary responsibilities focus on technical leadership, process development, transfer to production, and cross-functional execution.

• Develop and optimize metals deposition processes (PVD, CVD, ALD) for frontend, middle-of-line, and BEOL interconnect applications.
• Lead data-driven root-cause analysis and structured problem solving for yield and performance issues.
• Drive technology transfer from TD to HVM, including POR definition, process window characterization, tool matching, and release to production.
• Collaborate with integration, device, yield, defect metrology, reliability, equipment and materials suppliers to implement solutions.
• Manage cross-functional teams and stakeholders, define team goals, remove roadblocks, and ensure timely delivery of process solutions.
• Stay current with industry trends and incorporate relevant direction-setting technologies into strategy.
• Work together in person with team members to accelerate decision making and problem resolution (hybrid work model).

Requirements

Must-have technical experience, practical skills, and professional attributes.

• 6+ years relevant semiconductor manufacturing, process development, or technology development experience.
• 4+ years direct experience in metals deposition modules and 3+ years with one or more deposition technologies (PVD, CVD, ALD) for metals or barrier/liner stacks.
• Hands-on ownership of deposition equipment (multi-chamber PVD/CVD/ALD platforms), including qualification and tool matching.
• Experience with integration and module interactions (deposition with CMP, lithography, etch, clean) and impact on device performance and yield.
• Proven ability to drive process development, optimization, and transfer to HVM under schedule pressure.
• Strong data analysis and problem-solving skills using structured methods and analytics tools.
• Effective written and verbal communication and demonstrated cross-functional leadership.
• Experience collaborating with equipment and materials suppliers to implement hardware or chemistry changes.

Education Requirements

Minimum: Master’s degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field. Preferred: Ph.D. Equivalent combinations of industry experience, internships, and academic coursework are acceptable as noted in the posting.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.