Senior Thermal Engineer

Job Title

Senior Thermal Engineer

Role Summary

Responsible for end-to-end thermal solutions for a multi-die AI accelerator, owning the thermal path from die junction to facility water. You will set the junction-temperature budget and define cold plate, sled and rack cooling architectures used by the hardware team.

This is a hands-on senior IC/hardware role based in Barcelona with a 4-days-per-week office cadence and 1 day remote work.

Experience Level

Senior - 8+ years in electronics thermal engineering for high-power computing, datacenter, or comparable systems.

Responsibilities

Key responsibilities include:

• Build detailed and compact thermal models of die, package and board; perform transient analysis using real workload power profiles.
• Run CFD and conjugate heat transfer studies for cold plate, sled and rack-level designs.
• Specify cold plate geometry, flow rates, pressure drop, TIM stack and bond line targets; own junction temperature budgets across rails and dies.
• Define system and rack-level coolant distribution, coolant temperature setpoints, redundancy and failure behavior.
• Lead thermal validation on silicon: instrumentation, on-die sensor correlation, flow and pressure measurement, and model-to-measurement correlation.
• Collaborate with mechanical, power and vendor teams on mounting, throttling policy and component qualification.

Requirements

Must-have qualifications:

• 8+ years in electronics thermal engineering for high-power computing, datacenter or comparable systems.
• Proven ownership of thermal solutions for a processor, GPU, ASIC or FPGA at high TDP, including package-level analysis.
• Strong CFD and thermal simulation experience (Icepak, Flotherm, Star-CCM+ or equivalent).
• Liquid cooling design experience: cold plates, flow and pressure budgeting, and loop behavior.
• Working knowledge of TIM selection, bond line control and thermal interface reliability.
• Hands-on thermal validation and model-to-measurement correlation experience.

Nice-to-have:

• 2.5D, interposer or chiplet package thermal co-design.
• Two-phase, immersion or direct-to-chip cooling experience.
• Familiarity with OCP rack cooling standards, ORv3 or facility water interface design.
• Electro-thermal co-simulation experience with power delivery/PDN teams.
• Python for automation, model generation and test data analysis.

Education Requirements

Not specified.

About the Company

Company: Semidynamics

Headquarters: Barcelona, Spain

Semidynamics is a company specializing in infrastructure verification and automation solutions. They focus on optimizing resources and enhancing continuous integration processes in design verification. The team collaborates to maintain regression test infrastructure and develop efficient workflows.