Senior Testchip SoC Physical Design Engineer (Integration & Methodology)
Join Intel Foundry's Design Technology Platform (DTP) on the X-Chip SoC Full-Chip Integration team to develop physical design methodology and drive full-chip SoC integration for testchip vehicles that validate advanced process technologies and support manufacturing readiness.
The role requires collaboration with design, process, and manufacturing partners to deliver scalable, production-oriented layout solutions for advanced technology nodes.
Senior β approximately 5+ years of relevant experience (posting specifies a minimum of 5 years).
Primary responsibilities include methodology development, full-chip integration, and driving layout convergence for testchip SoCs.
Must-have technical skills and experience; preferred items listed as additional strengths.
Master's degree in electrical engineering or a related field is required (posting specifies a Master's). The posting also specifies a minimum of 5 years of relevant experience. Fields referenced: Electrical Engineering or related technical fields.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
