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Senior Testchip SoC Physical Design Engineer (Integration & Methodology)

Intel Corporation
May 15, 2026
Full-time
Remote friendly (Hillsboro, Oregon, United States)
Worldwide
$141,910 - $200,340 USD yearly
Physical Design Jobs, Level - Senior

Job Title

Senior Testchip SoC Physical Design Engineer (Integration & Methodology)

Role Summary

Join Intel Foundry's Design Technology Platform (DTP) on the X-Chip SoC Full-Chip Integration team to develop physical design methodology and drive full-chip SoC integration for testchip vehicles that validate advanced process technologies and support manufacturing readiness.

The role requires collaboration with design, process, and manufacturing partners to deliver scalable, production-oriented layout solutions for advanced technology nodes.

Experience Level

Senior β€” approximately 5+ years of relevant experience (posting specifies a minimum of 5 years).

Responsibilities

Primary responsibilities include methodology development, full-chip integration, and driving layout convergence for testchip SoCs.

  • Develop layout design methodology for testchip development in next-generation process nodes.
  • Work with Process Integration, Yield, and QnR to define critical design features to exercise in lead vehicle test chips.
  • Establish, oversee, and maintain hierarchical layout design specifications for correct-by-construction integration.
  • Build and execute plans to converge hierarchical SoC layouts against aggressive schedules, coordinating with PDK teams.
  • Drive physical design convergence: prepare layout hierarchy for tape-in, debug and resolve verification tool issues.
  • Collaborate with tool/flow owners and vendors to improve tools and methodologies.
  • Coordinate stakeholders to reach execution commit and ensure timely testchip delivery.

Requirements

Must-have technical skills and experience; preferred items listed as additional strengths.

  • Experience with physical/layout design in advanced technology nodes.
  • Proficiency with layout design tools such as Cadence Virtuoso Suite or Synopsys Custom Compiler.
  • Knowledge of design rules and layout constraints in advanced semiconductor processes.
  • Experience with floorplanning, hierarchical design integration, and layout verification/debug.
  • Strong verbal and written communication skills and ability to work both autonomously and in cross-functional teams.
  • Preferred: Experience defining testchip/product design from concept to execution commit.
  • Preferred: Experience working with foundry teams to negotiate features to exercise in designs.
  • Preferred: Project management skills coordinating and tracking design cycles; prior foundry experience is a plus.

Education Requirements

Master's degree in electrical engineering or a related field is required (posting specifies a Master's). The posting also specifies a minimum of 5 years of relevant experience. Fields referenced: Electrical Engineering or related technical fields.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-05-14