Skip to main content
Intel Corporation logo

Senior Technical Lead - CPU Physical Design

Intel Corporation
October 20, 2026
Full-time
Remote friendly (Bengaluru, Karnataka, India)
Worldwide
Physical Design Jobs, Level - Senior

Job Title

Senior Technical Lead - CPU Physical Design

Role Summary

Lead physical implementation of next-generation CPU IPs from floorplanning through signoff. Provide technical leadership across the physical design lifecycle to drive PPA (performance, power, area) optimization, design convergence, methodology adoption, and execution for high-performance CPU products.

Experience Level

Senior-level. Typical candidate has 14+ years of industry experience in ASIC or CPU physical design.

Responsibilities

Accountable for physical design delivery, cross-functional coordination, and technical mentorship across multiple projects.

  • Lead physical design execution for CPU IPs from design planning through signoff.
  • Define and implement floorplanning, placement, CTS, routing, and signoff strategies for advanced CPU architectures.
  • Drive timing closure, congestion resolution, and power/area optimization to meet aggressive PPA targets.
  • Partner with Architecture, RTL, Circuit Design, DFT, CAD, Power, and Signoff teams to achieve implementation goals.
  • Identify and resolve complex implementation, timing, signal/power integrity, and EM/IR issues.
  • Promote methodology improvements, automation, and AI-driven workflows in collaboration with CAD teams.
  • Support planning, estimation, risk assessment, execution tracking, and signoff readiness.
  • Mentor engineers, participate in hiring and technical interviews, and develop engineering talent.

Requirements

Must-have technical skills and experience; preferred items noted where applicable.

  • 14+ years of industry experience in ASIC or CPU physical design.
  • Proven track record delivering products through complete physical implementation and signoff cycles.
  • Deep expertise in floorplanning, placement & optimization, clock tree synthesis, routing, static timing analysis, and physical verification.
  • Experience with signal integrity, power integrity, and EM/IR analysis.
  • Hands-on experience with industry implementation and signoff tools such as Synopsys Fusion Compiler, ICC2, Cadence Innovus, PrimeTime, StarRC, RedHawk, and Calibre.
  • Strong scripting and automation skills (Python, Tcl, Shell).
  • Ability to evaluate implementation trade-offs and provide technical recommendations that influence architecture and design decisions.
  • Experience working with geographically distributed teams and leading technical initiatives.
  • Preferred: experience with high-performance CPU core, cache, fabric, or compute IP designs and advanced process technologies (Intel 18A/14A, TSMC N3/N2 or equivalent).
  • Preferred: experience driving CAD methodology improvements, automation initiatives, and familiarity with AI/ML applications for design automation.

Education Requirements

M.Tech, MS, or PhD in Electrical Engineering, Computer Engineering, VLSI, or a related discipline.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

Intel Corporation logo

Date Posted: 2026-10-15