Senior System and Manufacturing Co-Design Architect - Power, Thermal and Packaging
NVIDIAJob Title
Senior System and Manufacturing Co-Design Architect - Power, Thermal and Packaging
Role Summary
The Silicon Co-Design Group develops cross-domain solutions at the intersection of architecture, silicon, systems, and manufacturing to enable next-generation GPU performance. This role identifies emerging physical constraints in power delivery, thermal dissipation, and packaging and drives engineering responses across silicon, packaging, firmware, and manufacturing.
Position is hybrid with work based in Santa Clara, CA. Base salary ranges by level: Level 5: 196,000β310,500 USD; Level 6: 232,000β368,000 USD. Equity and benefits are also offered.
Experience Level
Senior-level. Expect approximately 12+ years of relevant experience.
Responsibilities
Provide technical leadership to anticipate and mitigate manufacturability and system-level constraints.
- Analyze packaging, power delivery, and thermal dissipation limits against roadmap demands and predict competitiveness impacts.
- Develop cross-domain solutions spanning silicon features, packaging innovation, firmware, hardware co-design, and DFX.
- Assess emerging packaging technologies for voltage/frequency capability, noise, reliability, and testability trade-offs.
- Drive system-manufacturing co-design to improve performance, performance-per-watt, and provisioning efficiency.
- Collaborate across architecture, packaging, manufacturing, and test teams to implement solutions at scale.
Requirements
Core qualifications and desirable attributes.
- 12+ years of relevant experience in high-performance computing systems or equivalent roles.
- Deep technical understanding of power delivery, thermal dissipation, and current density in GPU/CPU systems.
- Proven ability to convert physical-limit trends into measurable engineering impact and actionable solutions.
- Demonstrated cross-functional influence and experience working with packaging, manufacturing, test, and product teams.
Nice-to-have:
- Experience solving multi-domain problems spanning electrical, thermal, mechanical, and manufacturing domains.
- Experience using AI to accelerate design-space exploration and problem-space modeling.
- Track record of elevating technical discussions and driving practical outcomes.
Education Requirements
BS, MS, or PhD in Electrical Engineering, Computer Engineering, Physics, or a related technical field β or equivalent practical experience.
About the Company
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
