Senior Staff Packaging Engineer

Job Title

Senior Staff Packaging Engineer

Role Summary

Responsible for designing and developing semiconductor package and interconnect solutions (power SiP/modules, flip‑chip LGA, multi‑chip modules, leadframe and power device packages) to meet thermal, density and reliability requirements for AI, HPC and power-delivery applications. Collaborate with product, reliability, operations and external OSAT/CM partners to qualify packages and transition designs into production.

Experience Level

Senior-level. 5–15 years of relevant packaging and process development experience.

Responsibilities

Key responsibilities include:

• Design and develop package and interconnect methods for power SiP/modules, flip‑chip LGA, multi‑chip modules and power device packaging.
• Collaborate with OSAT/CM to plan and execute DOEs, optimize processes, and establish process specifications.
• Work with Product and Reliability teams to qualify new packages and processes within required schedules.
• Ensure smooth production transitions by resolving process integration issues and establishing production controls and monitors.
• Maintain technical expertise on advanced leadframe, power SiP/module and flip‑chip interconnect technologies.
• Investigate and resolve internal and external customer complaints with cross‑functional teams (Marketing, Product, Quality, Operations).

Requirements

Required skills and experience:

• 5–15 years' experience in package development emphasizing leadframe, laminate, power SiP/module, flip‑chip packaging, and wafer front‑side/back‑side metallization processing.
• Practical understanding of semiconductor power device package assembly processes, materials and technology.
• Knowledge of wafer front‑side/back‑side metallization, wire‑bonding, flip‑chip, multi‑chip module processes, SPC and statistical analysis.
• Proficiency with AutoCAD and office tools (Excel, PowerPoint, Word).
• Strong interpersonal, communication, analytical and presentation skills.
• Experience with OSAT/CM collaboration, DOE execution and process qualification activities. (Preferred)

Education Requirements

Master's or Bachelor's degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.