Senior Staff Packaging Design Engineer

Job Title

Senior Staff Packaging Design Engineer

Role Summary

Lead execution of complex semiconductor package designs (2.5D/3D, chiplet architectures) at AMD's Singapore site. Responsible for substrate layouts, bump maps, interposer designs, and cross-functional coordination to meet performance, cost, quality, and schedule targets.

Drive methodology improvements, apply automation and AI-driven flows, and mentor junior engineers to scale package design delivery.

Experience Level

Senior-level. The posting indicates a senior/staff role; specific years of experience are not stated.

Responsibilities

Accountable for technical leadership, delivery, and cross-functional coordination across multiple concurrent packaging programs.

• Lead end-to-end package design for complex products, meeting performance, cost, quality, and schedule objectives.
• Develop substrate layouts, bump maps, interposer and chiplet designs for 2.5D/3D integration.
• Collaborate with SI/PI, mechanical, and SoC teams to drive design decisions and signoff readiness.
• Work with OSATs, substrate suppliers, and foundries to implement optimized solutions and manage risks.
• Contribute to tapeout processes, design reviews, and readiness assessments.
• Define and improve package design methodologies, flows, and standards; promote reuse and layout efficiency.
• Mentor junior engineers and promote engineering excellence across the team.

Requirements

Technical and operational requirements for successful performance.

Must-have:

• Proven experience in package or silicon physical design and execution for advanced packaging projects.
• Hands-on experience with advanced packaging technologies: 2.5D/3D integration, interposers, chiplet-based architectures, substrate layouts and bump maps.
• Familiarity with EDA tools such as Cadence SIP/APD, Synopsys 3DICC or equivalents.
• Practical understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals.
• Experience collaborating with OSATs, substrate vendors, and foundries to deliver production-ready designs.
• Ability to manage multiple concurrent programs in fast-paced, high-pressure environments and to work with minimal supervision.
• Experience applying automation, AI/ML, or scripting to improve design productivity and quality.

Nice-to-have:

• Direct experience designing complex substrates, silicon bridges, or interposers.
• Prior leadership or mentorship experience in packaging teams.
• Exposure to design standardization, reuse strategies, and layout efficiency improvements.

Education Requirements

Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or a related field as specified in the posting.

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.