Senior Staff Package Design Engineer

Job Title

Senior Staff Package Design Engineer

Role Summary

Lead design and development of semiconductor package and interconnect solutions focused on power SiP/modules, flip-chip LGA, and multi-chip modules. Coordinate with product, reliability, operations, and OSAT/CM partners to qualify packages, establish production controls, and support volume ramp for automotive, industrial and consumer power applications.

Experience Level

Senior-level; typically 10–15 years of relevant package development experience.

Responsibilities

Accountable for package technology development, qualification, and transition to production. Key responsibilities include:

• Design and develop package and interconnect solutions for power SiP/modules, flip-chip LGA, and multi-chip modules with substrates or embedded components.
• Define and execute qualification plans for consumer, industrial, and automotive power packages.
• Benchmark and select materials, processes, OSATs, and contract manufacturers; establish process specifications.
• Plan and run DOE with OSATs/CMs to optimize assembly processes and establish process control limits.
• Work with product and reliability teams to qualify new packages within schedule.
• Resolve process integration and production issues; perform critical window checks and SPC monitoring.
• Establish production controls and monitor ramp to ensure quality and yield targets.
• Maintain technical expertise on packaging innovations and contribute to packaging roadmap and design rules.
• Investigate and address customer complaints in coordination with marketing, quality, and operations.

Requirements

Essential technical skills and experience for the role:

• 10–15 years of hands-on experience in package development emphasizing power SiP/modules, wafer-level packaging and flip-chip LGA.
• Deep knowledge of assembly processes, qualification methods, and production integration with OSATs/CMs.
• Experience with statistical process control (SPC) and statistical analysis software.
• Proven experience establishing process specifications, executing DOE, and supporting manufacturing ramp.
• Strong interpersonal, communication, analytical, and presentation skills.
• Nice-to-have: familiarity with Cu FSM/BGBM technologies.

Education Requirements

Doctorate, Master’s or Bachelor’s degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a closely related technical field.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.