Senior/Staff High Bandwidth Memory (HBM) Returned Material Authorization (RMA) Engineer

Job Title

Senior/Staff High Bandwidth Memory (HBM) Returned Material Authorization (RMA) Engineer

Role Summary

Lead failure analysis (FA) of customer-returned HBM DRAM components and modules, drive root-cause identification, containment and corrective actions, and communicate results to customers and internal engineering and manufacturing teams.

Work involves cross-functional coordination with FA, manufacturing, field support and system teams to resolve product issues and improve processes.

Experience Level

Senior — typically requires 5+ years of experience in the semiconductor industry.

Responsibilities

Primary responsibilities include managing failure analysis, coordinating technical investigations, reporting findings, and ensuring corrective actions are implemented.

• Manage FA for customer concerns: clarify failing conditions, oversee bench/system/ATE analysis, and coordinate electrical (EFA) and physical (PFA) analyses.
• Initiate and maintain customer communication to define failures and provide updates.
• Interpret analysis results and translate findings into customer-friendly reports.
• Review and follow up on manufacturing feedback and corrective actions; develop containment plans and risk assessments.
• Analyze data across sources to identify trends and required process improvements.
• Prepare interim and final FA reports and provide ongoing customer support for FA-related questions.
• Maintain current knowledge of device capabilities, datasheet specifications, process technology differences, and common DRAM applications.

Requirements

Must-have qualifications and skills:

• 5+ years of experience in the semiconductor field.
• Knowledge of DRAM operation, fabrication processes and semiconductor device physics.
• Advanced understanding of electronic circuits.
• Basic understanding of DRAM, motherboard and CPU architecture and operation.
• Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer/component/module testing flows.
• Strong written and oral communication skills; comfortable leading meetings.

Nice-to-have:

• Experience with computer, laptop or server OEMs; system-level debug, CPU, DRAM or SYSTEM FAE experience.

Education Requirements

Required: Bachelor’s degree in Electrical, Electronics, or Computer Engineering. Desired: Master’s degree in Electrical, Electronics, or Computer Engineering.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.