Senior SoC Architect (f/m/d)

Job Title

Senior SoC Architect (f/m/d)

Role Summary

Lead the SoC architecture for Black Semiconductor's Electronics-Photonics IC (EPIC) product, translating marketing requirements (MRD) into a complete, implementable product requirement document (PRD) that covers digital, analog, I/O, and memory subsystems.

This role owns the digital and high-speed I/O subsystem architecture (SerDes, UCIe, PCIe, Ethernet) and coordinates cross-domain integration with analog, photonics, packaging, and memory subsystem owners through to PRD sign-off.

Experience Level

Senior — 7–10 years of experience in SoC or product architecture roles with end-to-end architecture ownership.

Responsibilities

Primary responsibilities include defining and owning the full-chip architecture and driving cross-functional technical alignment.

• Translate MRD into a complete, internally consistent PRD covering digital, analog, I/O, and memory subsystems.
• Own digital subsystem architecture: core logic, on-chip interconnect fabric, and subsystem partitioning.
• Own high-speed I/O subsystem architecture with deep SerDes and protocol digital logic expertise for UCIe, PCIe, and Ethernet.
• Integrate subsystem architectures from Analog/RF, Photonics, Package SI, and memory owners into a coherent full-chip architecture.
• Drive full-chip performance, power, and area (PPA) trade-off analysis and make architecture-level decisions to keep the PRD feasible.
• Evaluate and coordinate with external vendors and 3rd-party IP providers for integration and validation.
• Author and maintain architecture specifications and requirements, present integrated architecture to product and engineering leadership, and own PRD through sign-off.

Requirements

Essential technical skills and experience required for the role.

Must-have:

• 7–10 years in SoC or product architecture with proven ownership from MRD to PRD across multiple subsystems and at least one full product architecture cycle.
• Hands-on high-speed I/O expertise (high-speed SerDes) and protocol digital logic for UCIe, PCIe, and Ethernet, including mapping protocol layers to physical SerDes implementations.
• Strong digital subsystem and interconnect fabric architecture experience for complex SoCs.
• Cross-domain integration skills to consolidate analog, photonics, packaging, and memory inputs into a consistent PRD.
• Experience with PPA trade-off analysis, architecture and performance modeling tools, and requirements management tooling for PRD/MRD traceability.
• Experience evaluating/selecting 3rd-party IP and working with external IP vendors and integration partners.
• Practical proficiency in Python or C++ for modeling, scripting, and analysis; familiarity with documentation/collaboration platforms for multi-domain coordination.

Nice-to-have:

• Prior role as SoC Chief Engineer with end-to-end accountability for full-chip architecture, schedule, and quality.
• Familiarity with silicon photonics or electro-optic I/O and implications for I/O subsystem architecture.
• Experience with advanced packaging (2.5D/3D, chiplets) and die-to-die/coherent interconnects such as CXL.
• Experience working directly with product management or customers to shape MRD-level requirements.

Education Requirements

Not specified.

About the Company

Company: Black Semiconductor

Headquarters: Aachen, Germany

Black Semiconductor is revolutionizing the semiconductor industry with innovative graphene solutions that enhance chip connectivity and efficiency. By merging electronic computing and photonic communication, the company aims to reshape how chips interact, driving significant advancements in power and speed. Their human-centered approach fosters collaboration and continuous learning, making it a dynamic place for professionals to grow and make an impact.