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Senior Signal Integrity Engineer – LPU Packaging

NVIDIA
June 23, 2026
Full-time
Remote friendly (Santa Clara, California, United States)
Worldwide
$168,000 - $310,500 USD yearly
Test Engineering Jobs, Level - Senior

Job Title

Senior Signal Integrity Engineer – LPU Packaging

Role Summary

Senior Signal Integrity Engineer on the Packaging and Systems team responsible for SerDes channel design, simulation, and correlation across die, package, board, connector, socket, and cable interfaces for data center and HPC platforms.

The role drives chip-package-board co-simulation and measurement correlation to deliver robust high-speed interconnect solutions for advanced packaging technologies (2.5D, 3D, multi-die) and platform-level integration.

Experience Level

Senior — typically requires 8+ years of industry experience in signal integrity, high-speed interconnect design, or related hardware development.

Responsibilities

Design, simulate, validate, and optimize high-speed channels and workflows for advanced packages and systems.

  • Lead SI design and analysis for high-speed SerDes channels across die, package, board, connector, socket, and cable domains.
  • Develop and maintain simulation flows for advanced packaging (2.5D, 3D, multi-die) with focus on loss, discontinuities, return paths, and crosstalk.
  • Build and validate chip-package-board co-simulation methodologies and channel models (S-parameters, IBIS-AMI, time/frequency domain).
  • Perform pre-layout and post-layout SI analysis, create electrical design guidelines, and review layouts for compliance with performance targets.
  • Correlate simulation with lab measurements using TDR, VNA, high-speed oscilloscopes, and translate findings into improved models and signoff confidence.
  • Drive SI modeling and optimization for package escapes, vias, interposers, substrates, sockets, and other channel structures.
  • Support interface bring-up, debug, margin analysis, and transfer correlation learnings into reusable flows.
  • Collaborate cross-functionally with ASIC, package, board, mechanical, thermal, and validation teams to co-optimize system-level electrical performance.
  • Automate analysis, data processing, and visualization to scale SI methodology across programs.

Requirements

Core technical skills and experience required; preferred qualifications listed separately.

Must-have
  • 8+ years of industry experience in signal integrity, high-speed interconnect design, or related hardware development roles.
  • Strong background in electromagnetics, transmission line theory, channel modeling, and high-speed serial link behavior.
  • Proven experience with high-speed SerDes design and channel analysis for advanced packaging or large-scale systems.
  • Hands-on experience with SI tools such as Ansys HFSS, SIwave, Cadence Sigrity, ADS, HSPICE, or equivalent.
  • Experience building and using channel models, S-parameters, IBIS-AMI flows, and time/frequency-domain analysis techniques.
  • Strong understanding of NRZ and PAM4 signaling, equalization techniques, jitter/noise mechanisms, and end-to-end channel budgets.
  • Experience with simulation-to-measurement correlation and lab-based validation using VNA, TDR, and high-speed scope measurements.
  • Ability to work effectively across cross-functional teams and drive technical decisions in a fast-moving product environment.
Nice-to-have
  • Experience with package and system SI for PCIe, CXL, NVLink, Ethernet, or other high-speed interfaces.
  • Deep knowledge of advanced packaging structures, substrates, interposers, and chip-package-board co-design.
  • Experience improving SI signoff methodology, building automation flows, or developing design rules.
  • Familiarity with cross-domain tradeoffs across SI, PI, thermal, mechanical, and manufacturability considerations.
  • Background in SI for data center, AI infrastructure, or HPC platforms.

Education Requirements

BS, MS, or PhD in Electrical Engineering, or equivalent practical experience. (The posting explicitly accepts equivalent experience in lieu of degree.)


About the Company

Company: NVIDIA

Headquarters: Santa Clara, California, USA

NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.

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Date Posted: 2026-06-21