Senior SI/PI Engineer (High-Speed Systems)
QualcommJob Title
Senior SI/PI Engineer (High-Speed Systems)
Role Summary
Support signal-integrity and power-integrity analysis for components and channels in high-speed systems. Work on component- and system-level simulations, evaluate system performance, and ensure compliance with channel and component specifications.
Collaborate with external component vendors and internal teams (BU, IP, package, PCB) to obtain and optimize component models and define requirements for Qualcomm products.
Experience Level
Senior-level. The posting specifies minimum experience combined with degree level (see Education Requirements) but does not give a separate seniority-year requirement.
Responsibilities
Primary responsibilities include simulation, evaluation, vendor collaboration, and support for package/PCB design.
- Perform component- and system-level SI/PI simulations using validated models.
- Evaluate component and channel performance against specifications.
- Collaborate with vendors to obtain, optimize, and debug component models and negotiate technical specifications.
- Work with BU, IP, package, and PCB design teams to define component, channel, and system requirements.
- Support package and PCB design teams with component recommendations and design requirements.
- Maintain and enhance the component model library.
Requirements
Must-have technical skills and domain experience; education details are listed in Education Requirements below.
- Experience in SI/PI with strong understanding of electromagnetics and transmission-line theory.
- Experience with electromagnetic field solvers such as HFSS, Q3D, or Clarity.
- Experience with circuit and system simulation tools such as ADS and HSPICE.
- Working knowledge of PCB/CAD tools such as Cadence Allegro or Mentor Xpedition.
- Proven ability to collaborate with component vendors and cross-functional engineering teams.
- Strong problem-solving and technical communication skills.
Nice-to-have:
- Experience developing or characterizing high-speed electrical or optical components.
- Experience with package or PCB design and interface specifications such as LPDDR, PCIe, or UCIe.
- Experience with co-packaged copper (CPC) or co-packaged optics (CPO).
- Industry experience in high-speed interconnects or related areas.
Education Requirements
Bachelor's, Master’s, or PhD in Electrical Engineering, Computer Engineering, Chemical Engineering, Mechanical Engineering, or a related technical field. The posting specifies degree-plus-experience combinations: Bachelor's +2 years, Master's +1 year, or PhD (no additional years specified).
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.
