Senior Semiconductor Package Design Engineer (2.5D/3D)
MicrossJob Title
Senior Semiconductor Package Design Engineer (2.5D/3D)
Role Summary
Design advanced semiconductor packages (2.5D/3D) and deliver manufacturable package solutions. The role focuses on package architecture, layout, and signal/power integrity analysis while coordinating with IC, PCB, manufacturing, test, and supply-chain teams.
Experience Level
Senior — typically 8–10 years of experience in semiconductor package design.
Responsibilities
Key responsibilities include leading package design activities and ensuring manufacturability and signal/power integrity.
- Lead package architecture and detailed layout for 2.5D/3D designs.
- Perform signal and power integrity analysis and verification.
- Use Allegro Package Designer Plus for package layout and data preparation.
- Define materials, thermal and mechanical constraints, and DFM requirements.
- Collaborate with IC, PCB, manufacturing, test, and supply-chain teams.
- Prepare design documentation, BOMs, and manufacturing release packages.
- Support prototype debug, yield improvement, and reliability investigations.
Requirements
Must-have technical skills and background.
- 8–10 years experience in semiconductor packaging design; 2.5D/3D experience preferred.
- Proven experience with Allegro Package Designer Plus.
- Experience with Sigrity or equivalent signal/power integrity tools.
- Knowledge of package materials, thermal/mechanical behavior, and DFM.
- Experience preparing manufacturing-ready documentation and supporting prototypes.
- Strong cross-functional communication and problem-solving skills.
Education Requirements
Bachelor's degree in Electrical Engineering.
About the Company
Company: Micross
Micross provides microelectronic packaging, engineering, assembly, testing and supply-chain services for advanced semiconductor and electronic components. They support custom package design, interposers, substrates, and related solutions for aerospace, defense and commercial markets.
