Senior RF Module Design Engineer

Job Title

Senior RF Module Design Engineer

Role Summary

Lead individual contributor responsible for design and development of RF/microwave single- and multi-chip modules and packaged products. Work within a cross-functional product development team covering package engineering, test, product engineering, manufacturing and applications to take products from concept through production.

Focus areas include module architecture, 3D electromagnetic package design, lab verification (DVT), and production support. This role may include mentoring junior engineers.

Experience Level

Senior; position expects multi-year professional experience in RF/mm-wave module or packaging design (see Education Requirements for specific degree/experience combinations).

Responsibilities

Primary duties and typical deliverables:

• Design and develop RF/mm-wave single- and multi-chip modules and transmit/receive front-end modules (FEMs).
• Integrate MMIC dies into air-cavity or over-mold modules and optimize package-level performance.
• Perform advanced package design and electromagnetic simulation using 2.5D/3D EM tools.
• Plan and execute product checkout, optimization, and design verification testing (DVT) in the lab.
• Analyze DVT results and present technical findings to internal and external stakeholders.
• Support products through concept/feasibility, development, qualification, and production lifecycle stages.

Requirements

Must-have technical skills and experience; desired items listed separately.

• Experience integrating microwave/millimeter-wave MMIC dies (amplifiers, switches, phase shifters, attenuators) into module-level products.
• Expert-level use of 3D EM simulation tools (e.g., HFSS, Analyst) and familiarity with circuit simulators such as ADS, Microwave Office or Cadence tools.
• Deep understanding of package performance tradeoffs across package types (QFN, laminates, FCBGA, LGA, air cavity, over-mold).
• Strong foundation in electromagnetic theory and RF fundamentals (s-parameters, impedance matching, transmission lines, passive structures).
• Hands-on experience with microwave measurements, characterization, and calibration methods.
• Knowledge of semiconductor technologies (GaN, GaAs, Silicon) and RF/power packaging materials and assembly processes.
• Strong verbal and written communication skills for summarizing technical concepts and results.
• Authorization: This position is not eligible for visa sponsorship by the company.

Nice-to-have:

• System-level RF signal chain and system analysis experience.
• Antenna design knowledge.
• Publication record in technical journals or conferences.
• Proven ability to meet customer technical requirements and schedules.

Education Requirements

Required degree combinations: BS in Electrical Engineering with 5+ years relevant experience; MS in Electrical Engineering with 3+ years relevant experience; or PhD in Electrical Engineering (RF/Microwave focus) with 1+ year relevant experience.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.