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Senior Regional Development Applications Engineer (CAPRES) – Regional (Taiwan/Asia)

KLA
June 24, 2026
Full-time
On-site
Hsinchu, Taiwan
Test Engineering Jobs, Level - Senior

Job Title

Senior Regional Development Applications Engineer (CAPRES) – Regional (Taiwan/Asia)

Role Summary

Lead strategic application engagement for CAPRES electrical and magnetic metrology solutions across Taiwan and Asia, with primary focus on leading logic customers and select regional accounts.

The role coordinates customer evaluations, drives new customer penetration and adoption at existing sites, and aligns regional application priorities with CAPRES headquarters and local teams. Opportunity to grow into a regional leadership role overseeing application engineers.

Experience Level

Senior level. The role expects multiple years of relevant semiconductor experience; minimum qualifications specify degree-based experience (see Education Requirements).

Responsibilities

Primary responsibilities include technical leadership, customer engagement, and regional coordination:

  • Drive strategic application engagement across Taiwan and Asia, focusing on leading logic customers and key regional accounts.
  • Define and coordinate application strategies, evaluation priorities, and customer support plans aligned to business objectives.
  • Support new customer penetration and expand adoption at existing customers by developing and promoting new applications and use cases.
  • Serve as senior technical interface for customers, providing application guidance, escalation support, and cross-engagement coordination.
  • Guide and support regional application engineers during on-site evaluations, deployments, troubleshooting, and implementation of use cases.
  • Capture customer requirements and technical challenges; translate them into recommendations for product and software improvements.
  • Coordinate cross-functional activities between customers, regional teams, and CAPRES headquarters to ensure aligned execution.
  • Provide mentoring, knowledge sharing, and drive consistency in regional application approach and quality.
  • Contribute to regional engagement planning and prioritization of opportunities.

Requirements

Must-have technical skills, experience, and capabilities:

  • Proven experience in semiconductor manufacturing with exposure to advanced logic applications.
  • Deep knowledge of electrical and magnetic characterization techniques and metrology workflows.
  • Hands-on familiarity with measurement techniques such as sheet resistance, CIPT, MOKE, and FMR.
  • Expertise in metrology data analysis and the ability to define application strategies from technical data.
  • Strong customer-facing experience, including technical leadership, engagement coordination, and stakeholder management.
  • Demonstrated ability to drive adoption growth and new customer penetration via application-driven strategies.
  • Ability to coordinate cross-functional teams and translate customer needs into regional priorities and product recommendations.
  • Leadership and mentoring capabilities to support and develop regional application engineers.
  • Direct customer exposure in Taiwan and/or major semiconductor accounts in Asia.
  • Fluency in Mandarin (Chinese) and English, both spoken and written.

Education Requirements

Doctorate (PhD) in Electrical Engineering, Physics, Materials Science, or related field with 4+ years relevant experience; or Master’s degree in these fields with 6+ years; or Bachelor’s degree in these fields with 8+ years of relevant experience. Fields: Electrical Engineering, Physics, Materials Science, or related technical fields (or equivalent practical experience).


About the Company

Company: KLA

Headquarters: Chennai, India

KLA is a global leader in diversified electronics for the semiconductor manufacturing industry. The company enables the production of electronic devices by inventing systems and solutions for manufacturing integrated circuits, wafers, and displays. With over 40 years of experience, KLA invests heavily in innovation and R&D to support advanced chip design and manufacturing process optimization, collaborating with top technology providers to deliver future electronic devices.

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Date Posted: 2026-06-24