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Senior PTE Hardware Engineer (Probe Card) - Zhubei

Qualcomm
May 17, 2026
Full-time
On-site
Hsinchu City, Hsinchu City, Taiwan
Test Engineering Jobs, Level - Senior

Job Title

Senior PTE Hardware Engineer (Probe Card) - Zhubei

Role Summary

Lead probe card hardware design and execution for high-volume semiconductor test solutions within the Product & Test Engineering (PTE) hardware team. The role owns technical delivery, vendor collaboration, design validation, and handoff for probe card projects.

Work closely with cross-functional teams (PTE, Ops, ME, sourcing) and external vendors to meet schedules, resolve technical issues, and improve probe card design and supplier processes.

Experience Level

Senior-level. Typically requires about 5–10 years of hands-on experience in probe card design, test hardware, or related semiconductor hardware development.

Responsibilities

Primary responsibilities include end-to-end probe card project leadership, coordination, and technical oversight.

  • Lead end-to-end probe card design: concept, schematic/layout review, design validation, and bring-up support.
  • Own technical execution and schedule from design kickoff through handoff to HOD/customer.
  • Serve as primary technical interface to external probe card vendors; drive design reviews, issue resolution, and schedule alignment.
  • Coordinate project timelines, resource planning, and priorities with internal cross-functional teams.
  • Track project status, identify schedule or technical risks, and implement mitigation plans.
  • Review and approve vendor deliverables, including design documents, layouts, and build readiness checkpoints.
  • Support root cause analysis and corrective/preventive actions for design, fabrication, or assembly issues.
  • Contribute to continuous improvement of probe card design flows, supplier engagement, and execution processes.

Requirements

Key technical and project-management requirements. Degrees are summarized separately under Education Requirements.

Must-have:

  • 5–10 years hands-on experience in probe card design, test hardware, or related semiconductor hardware development.
  • Solid understanding of probe card architectures, PCB design fundamentals, and signal integrity / power integrity considerations.
  • Familiarity with mechanical interfaces relevant to probe cards and test fixtures.
  • Proven experience working closely with external vendors or suppliers on hardware design and delivery.
  • Demonstrated ability to manage project schedules, dependencies, and engineering resources across multiple projects.
  • Strong written and verbal communication skills to align technical and schedule expectations across teams and suppliers.
  • Comfortable operating in a fast-paced, multi-project environment with changing priorities.

Nice-to-have:

  • Experience serving as HW project lead and facilitating design and progress review meetings.
  • Experience driving supplier improvements, cost reductions, or lead-time reduction initiatives.
  • Strong organization, documentation discipline, and familiarity with formal engineering procedures and methodologies.
  • Proven ability to generate and translate new ideas into technical solutions.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Computer Science, Electrical/Electronics Engineering, Engineering, or a related technical field is specified. A PhD in a related field is also listed as an option. The posting includes degree-plus-experience alternatives (e.g., Bachelor's + 2+ years, Master's + 1+ year) and a PhD option.


About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.

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Date Posted: 2026-05-15