Senior Product Engineer, Package PE Manufacturing — Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering

Job Title

Senior Product Engineer, Package PE Manufacturing — Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering

Role Summary

As a Senior Product Engineer in HIG HBM Product Engineering, you will lead package and HBM product engineering activities to improve quality, cost, cycle time, and scale across manufacturing and assembly flows. You will work on yield, failure analysis, process conversions, and product readiness for high‑bandwidth memory products as part of a global cross‑functional team.

Primary mission: drive yield and DPM improvements, diagnose and resolve packaging failures, and enable robust high‑volume manufacturing.

Experience Level

Senior — approximately 5 years of relevant engineering experience.

Responsibilities

Key responsibilities include:

• Drive assembly (ASM) yield and DPM improvement across manufacturing flows.
• Optimize test coverage and collaborate with technology and packaging teams to improve HBM cube yields.
• Lead cross‑functional initiatives to improve cumulative yield and product quality.
• Perform electrical and physical failure analysis (EFA/PFA) to identify root causes and implement corrective actions.
• Support backend process conversions and transitions to high‑volume manufacturing to reduce cost and increase yield.
• Provide technical leadership and make decisions on risk analysis and project prioritization.
• Mentor and develop engineers and technicians within the team.
• Collaborate with Fab, technology development, design, system development, and quality/reliability teams for product shipping.
• Advocate and support deployment of AI/ML models to improve KPIs (quality, cost, cycle time, scale).

Requirements

Must-have qualifications and skills:

• Strong leadership and technical problem-solving skills with demonstrated root‑cause analysis experience and circuit-level understanding.
• Proficiency with statistics, data analysis tools, and scripting for data‑driven investigations.
• Experience collaborating across functions to solve complex engineering and business problems.
• Effective communication and presentation skills and a professional work ethic.
• Willingness to work on site in Singapore and travel internationally (Taiwan, US, Japan).

Nice-to-have:

• Experience with EFA/PFA tools and backend packaging process conversions.
• Hands-on experience applying AI/ML techniques to manufacturing or quality problems.

Education Requirements

Bachelor's or Master's degree in Electrical, Electronic, or Mechanical Engineering, with about 5 years of relevant experience as stated in the posting. No specific certifications were listed; no explicit equivalent‑experience language was provided.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.