Senior Principal Packaging Engineer

Job Title

Senior Principal Packaging Engineer

Role Summary

Experienced technical lead in Package Innovation responsible for defining and delivering advanced and standard semiconductor packaging solutions across product lines (analog and power-focused). Works with cross-functional teams to take package technology from feasibility through production ramp.

Experience Level

Senior - requires significant experience (listed as 10+ years in packaging development and related fields).

Responsibilities

Lead technical definition and execution of package solutions to meet reliability, performance, manufacturability, and cost targets.

• Define package architectures, materials, structures, and assembly process flows.
• Drive cross-functional programs involving product, design, simulation, test, quality, reliability, manufacturing, suppliers, and external partners.
• Manage NPI and NTI deliverables: feasibility, design, prototype builds, characterization, qualification, risk retirement, release, and production ramp support.
• Monitor industry trends and define technology roadmaps for advanced and panel-level packaging and power packaging.
• Support manufacturing readiness with internal assembly sites and OSATs; may include international travel.

Requirements

Must-have technical experience and skills.

• 10+ years of experience in semiconductor packaging development, package technology, assembly process development, package design, product/package engineering, or related areas.
• Broad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, and power packages.
• Proven ability to lead complex cross-functional technical projects with multiple stakeholders.
• Clear written and verbal technical communication; able to present tradeoffs, risks, and recommendations to technical and management audiences.
• Fluent English (written and verbal).
• Willingness to travel internationally to assembly sites, suppliers, and partners as required.

Nice-to-have:

• Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, chiplets, heterogeneous integration, embedded die/passives, high-density substrates/RDL, hybrid bonding, or high power packaging.

Education Requirements

B.S. or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or a related technical field.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.