Senior Principal Engineer – GaN Package Development
NexperiaJob Title
Senior Principal Engineer – GaN Package Development
Role Summary
Define, develop, and industrialize advanced packaging technologies for GaN power devices and modules. Lead package architecture strategy and manage complex cross-functional programs from concept to high-volume manufacturing, serving as technical interface between R&D, manufacturing, suppliers, and customers.
Work within a global GaN team to deliver manufacturable, cost-efficient packaging platforms that meet electrical, thermal, and reliability targets.
Experience Level
Senior (principal-level technical leadership). Extensive industry experience in semiconductor backend and power packaging is expected.
Responsibilities
Key responsibilities include:
- Lead GaN package architecture development from concept through validation, optimizing electrical, thermal, and reliability performance.
- Drive innovation in packaging technologies, materials, and process solutions tailored to GaN devices.
- Develop and industrialize backend assembly processes and manage transfer from R&D to high-volume manufacturing.
- Ensure manufacturability, cost efficiency, quality, reliability, and yield; perform root cause analysis and continuous improvement.
- Define supplier, materials, and equipment strategies and manage key external partnerships.
- Act as technical lead across cross-functional teams, influencing device design, product definition, and system trade-offs.
- Mentor engineers, promote technical best practices, and represent the company in relevant industry forums.
Requirements
Must-have skills and experience:
- Extensive experience in semiconductor backend and GaN or advanced power packaging.
- Proven track record of bringing new packaging technologies into production and scaling to high-volume manufacturing.
- Strong knowledge of thermal management and reliability engineering for power devices.
- Experience with backend assembly processes and technology transfer to internal sites or OSAT partners.
- Demonstrated technical leadership, stakeholder management, and clear communication skills.
- Hands-on problem-solving ability and strategic thinking.
Nice-to-have:
- Experience with high-reliability applications such as automotive or industrial.
Education Requirements
Advanced degree (Master's or PhD) in Engineering, Materials Science, Microelectronics, or a related field preferred; or equivalent practical experience.
About the Company
Company: Nexperia
Headquarters: Cabuyao, Philippines
Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.
