Senior Power and Thermal Architect

Job Title

Senior Power and Thermal Architect

Role Summary

Senior architect in the Silicon Co-Design Group (SCG) responsible for identifying and maturing system- and datacenter-level power and thermal co-design ideas and driving them into product. The role partners across architecture, VLSI, software, platform, packaging, operations, and external research and industry bodies.

Focus areas include workload-aware power and thermal controls, platform telemetry and compliance, energy buffering, advanced cooling, and memory co-design.

Experience Level

Senior-level role. Requires substantial industry experience; the posting specifies 12+ years in system-level power, thermal, or related architecture.

Responsibilities

Lead research scouting, evaluation, and cross-functional delivery of system-level power and thermal innovations.

• Architect next-generation system, platform, and datacenter power and thermal co-design solutions by scanning internal research, academia, standards bodies, and partners.
• Define product-differentiation cases evaluating performance, power, reliability, schedule, and cost for candidate ideas.
• Lead end-to-end co-design from concept to production, coordinating architecture, VLSI, software, platform, packaging, and operations teams.
• Shape controls and telemetry: workload-aware power/thermal controls, closed-loop platform telemetry, and datacenter-class power compliance.
• Drive platform-scale energy buffering, advanced cooling intercepts, and memory co-design initiatives into product roadmaps.
• Maintain and report a living pipeline of candidate intercepts, productization status, and decision gates to leadership.
• Collaborate with system architects, platform and software engineers, manufacturing partners, and external researchers.

Requirements

Key qualifications and expected capabilities.

• Deep expertise in at least one area: system power management, system thermal architecture, platform energy architecture, workload-aware power/thermal controls, or memory co-design.
• Proven record of taking research-grade ideas through system co-design into measurable product impact.
• External technical recognition such as publications, patents, or contributions to industry standards and consortia.
• Demonstrated ability to influence cross-functional teams without direct authority and drive alignment across multiple engineering domains.
• Excellent problem-solving, communication, and partnership skills.

Nice-to-have:

• Machine learning or data-driven techniques applied to power/thermal modeling or design-space exploration.
• Experience with system reliability, aging, RAS, and lifecycle management as they intersect with power and thermal design.
• Hands-on familiarity with emerging memory technologies (e.g., advanced HBM, stacked memory).
• Active contributions to standards bodies, consortia, or external technical communities beyond basic participation.

Education Requirements

BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or equivalent practical experience. The posting explicitly allows equivalent experience in lieu of degree and highlights PhD-level research as a strong differentiator.

About the Company

Company: NVIDIA

Headquarters: Santa Clara, California, USA

NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.