Senior Photonics Packaging Engineer

Job Title

Senior Photonics Packaging Engineer

Role Summary

Lead the design, development, and integration of lasers, PICs, SOAs, and related photonic components into high-performance optoelectronic modules. Work closely with R&D, process, reliability, and test teams to deliver precision alignment, wafer-level packaging, and production-ready packaging processes for next-generation optical interconnects.

Experience Level

Senior — typically requires 5+ years of hands-on photonics packaging or equivalent industry experience.

Responsibilities

Deliver packaging solutions and processes from concept through production transfer, focusing on optical, mechanical, and thermal co-design.

• Design and develop photonic packaging for lasers, PICs, SOAs, and other optical components.
• Lead optical, mechanical, and thermal co-design for high-density optoelectronic assemblies.
• Develop and implement active and passive alignment strategies for sub-micron precision in fiber and chip coupling.
• Develop and validate photonic interconnect technologies (photonic wire-bond, co-packaged optics, fiber connectors).
• Conduct DFM and transfer packaging processes to volume production; collaborate with manufacturing teams.
• Evaluate and qualify materials, processes, and interconnects for packaging reliability and performance.
• Author design specifications, process flows, test protocols, and qualification documentation.

Requirements

Must-have technical skills, tools, and demonstrated hands-on experience; educational degree requirements are listed under Education Requirements below.

• 5+ years of hands-on photonics packaging experience, with focus on heterogeneous integration of lasers, PICs, and SOAs.
• Deep understanding of optical coupling techniques, waveguide interfaces, and photonic device behavior.
• Experience with cleanroom processes, micro-assembly, fiber attach, and packaging process development for manufacturability.
• Proficiency with CAD (SolidWorks), optical simulation tools (Lumerical, Zemax), and thermal modeling tools.
• Experience designing for transfer to volume production and performing DFM analyses.
• Strong problem-solving skills and ability to work collaboratively in a fast-paced environment.
• Nice-to-have: experience with silicon photonics or InP platforms; familiarity with high-speed optical transceivers and telecom/datacom standards; background in automated packaging systems and precision robotics; knowledge of RF packaging and signal integrity.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Optical Engineering, Physics, or a related technical field. The posting allows related-field backgrounds; equivalent practical industry experience may be considered.

About the Company

Company: Xscape Photonics

Headquarters: Santa Clara, California, United States

Developer of integrated photonics solutions and instrumentation, specializing in photonic circuits, control systems, and test methodologies for optical communication and sensing applications. Works on device integration, control algorithms, and validation of photonic hardware and firmware.