Senior Photonics Packaging Engineer

Job Title

Senior Photonics Packaging Engineer

Role Summary

Lead the design, development, and integration of lasers, PICs, SOAs and related photonic components into high-performance optoelectronic modules. Work with R&D, process, reliability, and test teams to deliver manufacturable packaging solutions for next-generation optical communication systems.

Experience Level

Senior-level. Role expects experienced candidates; the posting requests 5+ years of hands-on photonics packaging experience.

Responsibilities

Design, validate, and transfer photonic packaging solutions into production. Key responsibilities include:

• Design and develop packaging for lasers, PICs, SOAs, and other optical components.
• Lead optical, mechanical, and thermal co-design for high-density optoelectronic assemblies.
• Develop and drive active/passive alignment strategies for sub-micron precision in fiber and chip coupling.
• Evaluate and qualify materials, processes, and photonic interconnects (e.g., photonic wire-bond, co-packaged optics, fiber connectors).
• Conduct DFM and transfer packaging processes to volume production.
• Collaborate with cross-functional teams to optimize packaging architecture and testability.
• Author design specifications, process flows, and test protocols; support reliability and qualification activities.

Requirements

Must-have technical skills and experience:

• 5+ years of hands-on photonics packaging experience with focus on laser, PIC, and SOA heterogeneous integration.
• Deep understanding of optical coupling techniques, waveguide interfaces, and photonic device behavior.
• Experience with cleanroom processes, micro-assembly, and fiber attach.
• Proficiency with CAD tools (SolidWorks), optical simulation software (Lumerical, Zemax), and thermal modeling tools.
• Strong problem-solving skills and ability to work in a fast-paced, collaborative environment.

Nice-to-have / preferred:

• Experience with silicon photonics or InP platforms.
• Familiarity with high-speed optical transceivers and telecom/datacom standards.
• Background in automated packaging systems and precision robotics.
• Knowledge of RF packaging and signal integrity considerations.

Education Requirements

Bachelor's or Master’s degree in Electrical Engineering, Optical Engineering, Physics, or a related technical field.

About the Company

Company: Xscape Photonics

Headquarters: Santa Clara, California, United States

Developer of integrated photonics solutions and instrumentation, specializing in photonic circuits, control systems, and test methodologies for optical communication and sensing applications. Works on device integration, control algorithms, and validation of photonic hardware and firmware.