Senior Packaging Technical Engineer - Hardware
Senior packaging engineer responsible for defining chip pad ring, substrate interconnect scheme and leading the package layout design process for high-performance GPU hardware. The role collaborates with circuit, signal integrity, RTL, place-and-route, substrate layout and system engineering teams to deliver robust electrical package solutions.
Work focuses on chip floorplan, pad ring, substrate and ball-out implementations that meet electrical and system requirements.
Senior — minimum 8+ years of board/system design experience.
Primary responsibilities include package layout definition, cross-functional coordination, and ensuring electrical robustness of the package design.
Required and preferred technical skills and experience.
Bachelor of Science in Electrical Engineering (BSEE) or equivalent practical experience.
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
