Senior Packaging Technical Engineer - Hardware
Senior engineering role responsible for electrical package definition and package layout for GPU-class hardware. The role leads pad ring, substrate interconnect and package layout activities and works across circuit, SI, RTL, place-and-route, substrate layout and system teams.
Join a hardware packaging team focused on delivering robust electrical packages for NVIDIA platforms.
Senior β minimum 8+ years of relevant board or system design experience as stated in the posting.
The position owns electrical package definition and layout and coordinates cross-functional execution.
Key qualifications and skills for successful candidates.
Bachelor's degree in Electrical Engineering (BSEE) or equivalent practical experience.
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
