Senior Packaging Technical Engineer - Hardware
Responsible for electrical package architecture and package layout for GPU-class products. Works with circuit, signal integrity, RTL, place-and-route, substrate layout and system teams to define pad rings, substrate interconnects, and ball-outs that meet electrical and power-delivery requirements.
Leads package layout activities from concept through implementation and communicates decisions and trade-offs across engineering teams.
Senior; typically requires 5+ years' experience in board or system design.
Primary responsibilities include designing package electrical interfaces and coordinating cross-functional implementation:
Must-have and preferred technical qualifications:
Bachelor of Science in Electrical Engineering (BSEE) or equivalent practical experience.
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
