Senior Packaging Development Engineer - Substrate Modules

Job Title

Senior Packaging Development Engineer - Substrate Modules

Role Summary

Lead development and manufacturing readiness for substrate-based power module packages. Work with product teams, factory operations, and global packaging platforms to define and implement robust manufacturing processes from prototyping through product release to manufacturing (RTM).

Small motivating note: work on technologies that support high-volume power module manufacturing.

Experience Level

Senior-level. Minimum 5 years' experience in semiconductor manufacturing is required.

Responsibilities

Execute process development, product introduction, and transfer to manufacturing for substrate power modules.

• Optimize and establish robust high-speed process parameters for component attach, stack-up, and molding (transfer or compression).
• Define simplified manufacturing process sequences for component attach and module assembly.
• Manage new product execution from kickoff through prototyping, characterization, learning cycles, qualification, and RTM documentation.
• Collaborate with factory operations to meet manufacturing indices, quality standards, and cost targets.
• Coordinate with global package platform and emerging technology teams to establish process capabilities and roadmap execution.
• Adopt and scale industry manufacturing capabilities in a high-volume environment to improve competitiveness.

Requirements

Must-have and preferred technical qualifications and skills.

• Must-have: Minimum 5 years' experience in semiconductor manufacturing, with hands-on skills operating machines and practical knowledge of material selection, process optimization, and yield improvement.
• Must-have: Practical experience with process characterization, defect reduction, and cross-functional execution in a manufacturing environment.
• Nice-to-have: Package layer design expertise (structural configuration, material selection, process flow).
• Nice-to-have: Experience with system-in-package (SiP) and exposed inductor integration; familiarity with power module packaging and DFM constraints.
• Nice-to-have: Experience coordinating SMT and back-end packaging processes and assembly of power module packages; substrate design and reliability experience.
• Nice-to-have: Knowledge of FMEA, process control plans, SPC, DOE; experience with JMP or similar statistical tools.
• Nice-to-have: Project management experience in semiconductor assembly, test, or SMT operations and the ability to engage geographically distributed teams and suppliers.

Education Requirements

Bachelor's degree in Mechanical Engineering, Physics, Material Science, or a related field is required. The posting specifies a cumulative CGPA greater than 3.3. (Degree level listed as Bachelor's Degree.)

About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.